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Maintenance Object Repair Procedures
555-233-123 10-1624 Issue 4 May 2002
23006 FAIL Could not send a test message to MTP.
1. Repeat the same test again.
2. Look for PROCR and MEM-BD errors in the Error Log. If
such errors are present, refer to PROCR (80286
Processor circuit pack) and MEM-BD (Memory)
Maintenance documentation.
3. If no tests on the Memory circuit pack or Processor circuit
pack fail, escalate the problem.
23007 FAIL Operation timed out.
1. Do the steps below following the directions in the ‘‘Tape
Maintenance and Repair Procedures’’ section.
2. Issue the test tape long command.
3. If the test fails, make sure tape is fully inserted.
4. If the test continues to fail, clean the tape head and retest.
5. If fail, swap tape and retest.
6. If the test still fails, swap tape unit, use original tape and
retest.
23008 FAIL MTP indicates a test failure.
1. Follow the instructions provided in the ‘‘Tape
Maintenance and Repair Procedures’’ section.
23009 to
23017 FAIL Hardware problem. Problem accessing test Memory locations
#1, #2, and #3.
1. Follow the procedures provided in the ‘‘Tape
Maintenance and Repair Procedures’’ section.
9000’s ABORT Refer to Table A, ‘‘Tape Unit Aux Data/Error Codes Tables’’
and follow the recommended repair strategy for the specific
error code.
Any
Others ABORT Refer to Table B, ‘‘Tape Unit Aux Data/Error Codes Tables’’
and follow the recommended repair strategy for the specific
error code.
PASS If this test passes, the TN770 Memory and the TN773
Processor circuit packs are in good working order. This is not
a test of the tape cartridge or of the TN774 Tape Drive circuit
pack.
Table 10-600. TEST #230 DMA Latch Test — Continued
Error
Code Test
Result Description/Recommendation
Continued on next page