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DUPINT (Duplication Interface Circuit Pack)
Issue 4 May 2002
10-701
555-233-123
DUPINT (Duplication Interface Circuit
Pack)
In High or Critical Reliability PPN systems, there are two Duplication Interface
(DUPINT) circuit packs: one in carrier A and one in carrier B. Together, both circuit
packs provide memory shadowing (see “SHDW-CIR” for a full description) and
communication between software on the Active and Standby SPEs. By itself,
Duplication Interface circuit pack A provides control of the duplicated Processor
circuit pack, environmental maintenance monitoring and control, and
administration terminal connection.
TN792 circuit pack
Upgrade compatibility
The TN792 Duplication Interface circuit pack is not backward compatible (only
works with system running Release 7 or greater software) because it provides
enhanced duplication by using the Enhanced M-Bus (EM-Bus) functionality in the
TN2404/TN790 processor circuit pack. The EM-Bus provides 32-bit address and
data access to improve shadowing speed and increase the shadowed memory
range. This means that:
■
The TN792 can replace the TN772 Duplication Interface pack, however it is
not compatible with TN772. If one Duplication Interface circuit pack is
upgraded from TN772 to TN792, then you must upgrade the other side.
■
The TN792 is compatible only with the TN2404/TN790 processor circuit
pack that must be upgraded simultaneously with the DUPINT circuit packs.
■
Existing cables are compatible with the TN792 circuit pack.
■
When swapping TN772s for TN792s, power down both the active and
standby carriers, swap the circuit packs, and reapply power to the carriers.
Faceplate connections
An optical cable interface connects on the front faceplate of the TN792 to shadow
data between Duplication Interface circuit packs.
MO Name (in
Alarm Log)
Alarm
Level
Initial Command
to Run
1
1
Alarms on Duplication Interface circuit pack in the A carrier are always major alarms and
alarms on Duplication Interface circuit pack in the B carrier are always warning alarms.
Determine the carrier to test from the
Port
field in the Alarm or Error Log.
Full Name of MO
DUPINT
MAJOR
test duplication 1C
Duplication Interface Circuit Pack
DUPINT
WARNING
test duplication 1C
Duplication Interface Circuit Pack
Содержание Definity SI
Страница 1: ...0DLQWHQDQFH IRU YD D 1 7 6HUYHU 6 Volumes 1 2 and 3 555 233 123 Issue 4 May 2002...
Страница 62: ...Maintenance Architecture 555 233 123 1 26 Issue 4 May 2002...
Страница 92: ...Management Terminals 555 233 123 3 26 Issue 4 May 2002...
Страница 204: ...Routine Maintenance Procedures 555 233 123 5 100 Issue 4 May 2002...
Страница 250: ...LED Interpretation 555 233 123 7 10 Issue 4 May 2002...
Страница 2763: ...VC DSPPT Issue 4 May 2002 10 1977 555 233 123 Figure 10 107 VC Circuit Pack DSP Port Local TDM Loopback Test...
Страница 2776: ...Maintenance Object Repair Procedures 555 233 123 10 1990 Issue 4 May 2002 Figure 10 109 VC Circuit Pack Summer Port Loopback Test...
Страница 2804: ...Maintenance Object Repair Procedures 555 233 123 10 2018 Issue 4 May 2002...
Страница 2968: ...Index 555 233 123 IN 10 Issue 4 May 2002...