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EXP-INTF (Expansion Interface Circuit Pack)
Issue 4 May 2002
10-761
555-233-123
EXP-INTF (Expansion Interface Circuit
Pack)
!
CAUTION:
A detailed flowchart for isolating and resolving Packet Bus faults is included
in Chapter 9, “Packet Bus Fault Isolation and Correction”. This flowchart,
along with the other information presented in the chapter, can help in
resolving problems relevant to the Packet Path of the TN570 Expansion
Interface. Whenever the repair procedures for this Maintenance Object refer
to Packet Bus and/or Packet Control maintenance, be sure to reference
Chapter 9, “Packet Bus Fault Isolation and Correction” in addition to the
relevant MO documentation.
The TN570 or the TN776 Expansion Interface circuit pack is used to provide
connectivity between the Processor Port Network (PPN) and either Expansion
Port Network (EPN) (network 2 or 3) or between the two Expansion Port
Networks. The TN776 Expansion Interface is used in G1 systems to provide
connectivity between the Processor Port Network and the (single) Expansion Port
Network. This connectivity is provided via a 32 Mbps fiber optic cable. The TN776
supports circuit-switched connections and the control channel to and from the
EPN. The TN570 also supports packet-switched connections for those systems
that use the Packet Bus. The TN776 and TN570 circuit packs must only be used
in matched pairs. A TN776 circuit pack does not function if connected via fiber to a
TN570 circuit pack and vice versa.
The EPN(s), if present, are always under the control of the TN777 Processor
circuit pack in the PPN. Therefore, if the Expansion Interface circuit packs to the
EPN are not functioning correctly, service may be unavailable in that EPN, but is
available in the PPN. If the Expansion Interface circuit packs between EPNs are
not functioning properly, there is service in all networks, but connectivity between
EPN and EPN is not available.
MO Name (in
Alarm Log)
Alarm
Level
Initial Command
to Run
1
1
Where P is the port network number 1, 2, or 3, C is the carrier designation (for example,
A, B, C, or D); and SS is the address of the slot in the carrier where the circuit pack is
located (for example, 01, 02, etc).
Full Name of MO
EXP-INTF
MAJOR
test board PCSS sh
Expansion Interface Circuit Pack
EXP-INTF
MINOR
test board PCSS sh
Expansion Interface Circuit Pack
EXP-INTF
WARNING
test board PCSS sh
Expansion Interface Circuit Pack
Содержание Definity SI
Страница 1: ...0DLQWHQDQFH IRU YD D 1 7 6HUYHU 6 Volumes 1 2 and 3 555 233 123 Issue 4 May 2002...
Страница 62: ...Maintenance Architecture 555 233 123 1 26 Issue 4 May 2002...
Страница 92: ...Management Terminals 555 233 123 3 26 Issue 4 May 2002...
Страница 204: ...Routine Maintenance Procedures 555 233 123 5 100 Issue 4 May 2002...
Страница 250: ...LED Interpretation 555 233 123 7 10 Issue 4 May 2002...
Страница 2763: ...VC DSPPT Issue 4 May 2002 10 1977 555 233 123 Figure 10 107 VC Circuit Pack DSP Port Local TDM Loopback Test...
Страница 2776: ...Maintenance Object Repair Procedures 555 233 123 10 1990 Issue 4 May 2002 Figure 10 109 VC Circuit Pack Summer Port Loopback Test...
Страница 2804: ...Maintenance Object Repair Procedures 555 233 123 10 2018 Issue 4 May 2002...
Страница 2968: ...Index 555 233 123 IN 10 Issue 4 May 2002...