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13.2.1
Functional Interfaces
.........................................................................................
13.2.1.1
Basic SCM Pins
.........................................................................................
13.2.1.2
SCM Interface Description
.............................................................................
13.3
SCM Integration
........................................................................................................
13.3.1
Clocking, Reset, and Power-Management Scheme
.....................................................
13.3.1.1
Clock
......................................................................................................
13.3.1.2
Resets
....................................................................................................
13.3.1.3
Power Domain
...........................................................................................
13.3.1.4
Power Management
....................................................................................
13.3.1.4.1
System Power Management
......................................................................
13.3.1.4.2
Module Power Saving
..............................................................................
13.3.2
Hardware Requests
..........................................................................................
13.4
SCM Functional Description
..........................................................................................
13.4.1
Block Diagram
................................................................................................
13.4.2
SCM Initialization
.............................................................................................
13.4.3
Wake-Up Control Module
...................................................................................
13.4.4
Pad Functional Multiplexing and Configuration
...........................................................
13.4.4.1
Mode Selection
..........................................................................................
13.4.4.2
Pull Selection
............................................................................................
13.4.4.3
Pad Multiplexing Register Fields
......................................................................
13.4.4.4
System Off Mode
........................................................................................
13.4.4.4.1
Save-and-Restore Mechanism
...................................................................
13.4.4.4.2
Wake-Up Event Detection
.........................................................................
13.4.5
Extended-Drain I/O Pin and PBIAS Cells
.................................................................
13.4.5.1
PBIAS Cells
..............................................................................................
13.4.5.2
Extended-Drain I/Os
....................................................................................
13.4.6
Band Gap Voltage and Temperature Sensor
.............................................................
13.4.6.1
Band Gap Voltage Reference
.........................................................................
13.4.6.2
Temperature Sensor
....................................................................................
13.4.6.2.1
Single Conversion Mode (CONTCONV = 0)
....................................................
13.4.6.2.2
Continuous Conversion Mode (CONTCONV = 1)
..............................................
13.4.6.2.3
ADC Codes Versus Temperature
................................................................
13.4.7
Functional Register Description
............................................................................
13.4.7.1
Static Device Configuration Registers
................................................................
13.4.7.2
MPU and/or DSP (IVA2.2) MSuspend Configuration Registers
..................................
13.4.7.3
IVA2.2 Boot Registers
..................................................................................
13.4.7.4
PBIAS LITE Control Register
..........................................................................
13.4.7.5
Temperature Sensor Control Register
................................................................
13.4.7.6
Signal Integrity Parameter Control Registers With Pad Group Assignment
.....................
13.4.7.6.1
Signal Integrity Parameter Controls Overview
..................................................
13.4.7.6.2
DDR Buffer Drive Strength Related Settings
...................................................
13.4.7.6.3
High Speed I/Os Far End Load Settings
........................................................
13.4.7.6.4
Low-Speed I/Os Combined Slew Rate vs TL Length and Load Settings
...................
13.4.7.6.5
SDMMC Pullup Strength Control
.................................................................
13.4.7.6.6
I2Cx I/Os Group Pullupresx Controls and Load Range Settings
.............................
13.4.7.6.7
Device Interfaces Signal Group Controls Mapping
............................................
13.4.8
Protection Status Registers
.................................................................................
13.4.9
SDRC Registers
..............................................................................................
13.4.10
Debug and Observability
...................................................................................
13.4.10.1
Description
..............................................................................................
13.4.10.2
Observability Tables
...................................................................................
13.4.11
EMI Reduction for Clocking Generation (Spreading)
..................................................
13.4.11.1
Overview
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35
SWPU177N – December 2009 – Revised November 2010
Contents
Copyright © 2009–2010, Texas Instruments Incorporated
Содержание OMAP36 Series
Страница 174: ...174 List of Tables SWPU177N December 2009 Revised November 2010 Copyright 2009 2010 Texas Instruments Incorporated ...
Страница 692: ...692 MPU Subsystem SWPU177N December 2009 Revised November 2010 Copyright 2009 2010 Texas Instruments Incorporated ...
Страница 1084: ...1084 IVA2 2 Subsystem SWPU177N December 2009 Revised November 2010 Copyright 2009 2010 Texas Instruments Incorporated ...
Страница 1990: ...1990 2D 3D Graphics Accelerator SWPU177N December 2009 Revised November 2010 Copyright 2009 2010 Texas Instruments Incorporated ...
Страница 2334: ...2334 Memory Subsystem SWPU177N December 2009 Revised November 2010 Copyright 2009 2010 Texas Instruments Incorporated ...
Страница 2700: ...2700 Memory Management Units SWPU177N December 2009 Revised November 2010 Copyright 2009 2010 Texas Instruments Incorporated ...
Страница 2868: ...2868 HDQ 1 Wire SWPU177N December 2009 Revised November 2010 Copyright 2009 2010 Texas Instruments Incorporated ...
Страница 2974: ...2974 UART IrDA CIR SWPU177N December 2009 Revised November 2010 Copyright 2009 2010 Texas Instruments Incorporated ...
Страница 3054: ...3054 Multichannel SPI SWPU177N December 2009 Revised November 2010 Copyright 2009 2010 Texas Instruments Incorporated ...
Страница 3462: ...3462 MMC SD SDIO Card Interface SWPU177N December 2009 Revised November 2010 Copyright 2009 2010 Texas Instruments Incorporated ...
Страница 3508: ...3508 General Purpose Interface SWPU177N December 2009 Revised November 2010 Copyright 2009 2010 Texas Instruments Incorporated ...
Страница 3584: ...3584 Initialization SWPU177N December 2009 Revised November 2010 Copyright 2009 2010 Texas Instruments Incorporated ...
Страница 3648: ...3648 Debug and Emulation SWPU177N December 2009 Revised November 2010 Copyright 2009 2010 Texas Instruments Incorporated ...