Public Version
High-Speed USB OTG Controller
www.ti.com
•
DMA mode (transfer one or more packets)
•
Interrupt enable
•
Endpoint number
•
L3 interconnect memory address (32 bits)
•
Byte count
The DMA controller can issue single accesses (8-, 16-, or 32-bit) and also bursts (4 x 32-bit, 8 x 32-bit, or
16 x 32-bit) on the L3 interconnect. The start address provided to the DMA controller must be 32-bit
aligned.
22.1.4.5 Automatic Packet Splitting/Combining for Bulk Transfers
The high-speed USB controller offers the facility for bulk endpoints to store larger amounts of data in their
FIFOs than can be transferred in a single USB operation. In other words, the module includes a
configuration option that, if selected, allows larger data packets to be written to bulk TX endpoints, which
are then split into packets of an appropriate size for transfer across the USB. A similar option exists for
bulk RX endpoints, which, if selected, causes the module to combine the packet received across the USB
into larger data packets before being read by the application software.
The firmware can enable these options by setting the corresponding bits (MPRXE and MPTXE) in the
CONFIGDATA register. The necessary packet size information contains the payload size for one
transaction and a multiplier defining the maximum number of USB packets. The payload is required to be
either 8, 16, 32, 64, or (in case of high-speed transfers) 512 bytes; the multiplier can be any value up to
32.
22.1.4.6 High-Bandwidth Isochronous Endpoints
In the high-speed mode, isochronous endpoints can transfer up to three USB packets in any microframe
with a payload of up to 1024 bytes in each packet, corresponding to a data transfer rate of up to 3072
bytes per microframe (see Universal Serial Bus Specification Revision 2.0).
For TX endpoints, the high-speed USB controller supports this by allowing loading data packets of up to
3072 bytes (that is, 3 x 1024 bytes) into the associated endpoint FIFO, which is then automatically split
into USB packets of the maximum payload, or smaller to be transmitted in one microframe.
For RX endpoints, the module automatically combines all the USB packets received during a microframe
into a single packet of up to 3072 bytes (that is, 3 x 1024 bytes) within the RX FIFO.
The number of USB packets transferred per microframe and the maximum payload in each packet is
defined through the appropriate registers (RXMAXP and TXMAXP).
22.1.5 High-Speed USB OTG Controller Basic Programming Model
This section describes only the TI-specific programming model details.
22.1.5.1 High-Speed USB Controller Interface Selection
The TI High-Speed USB controller supports only the 12-pin/8-bit data version ULPI interface (see
).
The 8-pin, 4-bit version ULPI interface and 8-bit UTMI+ Level 3 interface are not supported.
The 12-pin/8-bit data SDR ULPI interface is selected through the USBOTG.
PHYSEL field set to 0x1.
22.1.5.2 Enable Simulation Acceleration Features
The USBOTG.
register is dedicated solely for simulation (see
) and is used
to reduce timer length and, hence, the time taken for the test bench to run.
This special mode can be active only during simulation and must be disabled for normal operation. The
firmware must keep TM1 inactive (reset value) during normal operation. An accidental write to this register
can cause a malfunction.
3226
High-Speed USB Host Subsystem and High-Speed USB OTG Controller
SWPU177N – December 2009 – Revised November 2010
Copyright © 2009–2010, Texas Instruments Incorporated
Содержание OMAP36 Series
Страница 174: ...174 List of Tables SWPU177N December 2009 Revised November 2010 Copyright 2009 2010 Texas Instruments Incorporated ...
Страница 692: ...692 MPU Subsystem SWPU177N December 2009 Revised November 2010 Copyright 2009 2010 Texas Instruments Incorporated ...
Страница 1084: ...1084 IVA2 2 Subsystem SWPU177N December 2009 Revised November 2010 Copyright 2009 2010 Texas Instruments Incorporated ...
Страница 1990: ...1990 2D 3D Graphics Accelerator SWPU177N December 2009 Revised November 2010 Copyright 2009 2010 Texas Instruments Incorporated ...
Страница 2334: ...2334 Memory Subsystem SWPU177N December 2009 Revised November 2010 Copyright 2009 2010 Texas Instruments Incorporated ...
Страница 2700: ...2700 Memory Management Units SWPU177N December 2009 Revised November 2010 Copyright 2009 2010 Texas Instruments Incorporated ...
Страница 2868: ...2868 HDQ 1 Wire SWPU177N December 2009 Revised November 2010 Copyright 2009 2010 Texas Instruments Incorporated ...
Страница 2974: ...2974 UART IrDA CIR SWPU177N December 2009 Revised November 2010 Copyright 2009 2010 Texas Instruments Incorporated ...
Страница 3054: ...3054 Multichannel SPI SWPU177N December 2009 Revised November 2010 Copyright 2009 2010 Texas Instruments Incorporated ...
Страница 3462: ...3462 MMC SD SDIO Card Interface SWPU177N December 2009 Revised November 2010 Copyright 2009 2010 Texas Instruments Incorporated ...
Страница 3508: ...3508 General Purpose Interface SWPU177N December 2009 Revised November 2010 Copyright 2009 2010 Texas Instruments Incorporated ...
Страница 3584: ...3584 Initialization SWPU177N December 2009 Revised November 2010 Copyright 2009 2010 Texas Instruments Incorporated ...
Страница 3648: ...3648 Debug and Emulation SWPU177N December 2009 Revised November 2010 Copyright 2009 2010 Texas Instruments Incorporated ...