Texas Instruments OMAP36 Series, Техническое справочное руководство

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OMAP3630 die
Bump
Underfill
Package size
Footprint - top side
Footprint -
bottom side
intro_swpu176-003
Top memory MCP package
Memory interface
0.5-mm pitch 152 balls
Bottom PBGA515 OMAP3630
POP package 0.4-mm pitch
515 balls
intro_swpu176-004
12x12mm
Public Version
www.ti.com
POP Concept
1.4 POP Concept
The OMAP die uses flip-chip technology. The OMAP36xx POP device supports memory stacking using a
POP implementation.
The POP device provides a generic POP memory interface to support multiple stacked package
configurations, including the flash multichip package, depending on customer needs.
The stacked memory package is connected directly to the two memory interfaces (GPMC and SDRC) of
the POP device through the POP interface present at the top. (For more information about the
interconnect between the stacked memory package and the POP device, see
Chapter 10 , Memory
Subsystem ).
Figure 1-3 shows the concept of the POP solution, and Figure 1-4 shows stacked memory package on the
POP device.
Figure 1-3. POP Concept
Figure 1-4. Stacked Memory Package on the POP Device
The memory interfaces must be configured correctly based on the memory package used with the POP
device.
Table 1-1 summarizes the supported configurations with the generic POP interface.
NOTE: For other types of memory, the traditional GPMC interface can be used through the board.
197 SWPU177N – December 2009 – Revised November 2010 Introduction
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