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12-36. INTCPS_MIR_SETn
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12-37. Register Call Summary for Register INTCPS_MIR_SETn
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12-38. INTCPS_ISR_SETn
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12-39. Register Call Summary for Register INTCPS_ISR_SETn
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12-40. INTCPS_ISR_CLEARn
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12-41. Register Call Summary for Register INTCPS_ISR_CLEARn
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12-42. INTCPS_PENDING_IRQn
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12-43. Register Call Summary for Register INTCPS_PENDING_IRQn
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12-44. INTCPS_PENDING_FIQn
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12-45. Register Call Summary for Register INTCPS_PENDING_FIQn
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12-46. INTCPS_ILRm
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12-47. Register Call Summary for Register INTCPS_ILRm
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12-48. INTC_SYSCONFIG
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12-49. Register Call Summary for Register INTC_SYSCONFIG
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12-50. INTC_IDLE
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12-51. Register Call Summary for Register INTC_IDLE
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13-1.
SCM I/O Description
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13-2.
Mode Selection
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13-3.
Pull Selection
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13-4.
Core Control Module Pad Configuration Register Fields
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13-5.
Core Control Module D2D Pad Configuration Register Fields
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13-6.
Wkup Control Module Pad Configuration Register Fields
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13-7.
Bit Directions for CONTROL_PADCONF_x Registers
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13-8.
PBIAS Cell and Extended-Drain I/O Pin Bit Controls
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13-9.
Power Supplies
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13-10. Band Gap Voltage and Temperature Sensor Signals Description
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13-11. ADC Code Versus Temperature
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13-12. Static Device Configuration Registers
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13-13. MSuspendMux Control Registers
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13-14. IVA2.2 Boot Registers
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13-15. IVA2.2 Boot Modes
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13-16. PBIAS Control Register
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13-17. Temperature Sensor Register
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13-18. Signal Integrity Parameter Control Registers
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13-19. DS Parameter Settings
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13-20. LB Parameter Settings for High-Speed I/O Cells
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13-21. Recommended SC vs LB Parameter Settings for TL With Length in the Range 2–20cm
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13-22. Recommended SC vs LB Parameter Settings for Dual TL With Length in the Range 20–40cm
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13-23. Group Pullup Strength Setting for SDMMC1 I/Os
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13-24. Example I2Cx Pullupresx vs I2C LB Parameter Settings in Different Modes
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13-25. Internal Pullup Resistor in Fast/HS Mode
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13-26. Signal Group Parameter Controls to Different Interface I/O Pads Mapping
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13-27. Protection Status Registers
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13-28. SDRC Registers
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13-29. Observability Registers
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13-30. Internal Signals Multiplexed on OBSMUX0
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13-31. Internal Signals Multiplexed on OBSMUX1
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13-32. Internal Signals Multiplexed on OBSMUX2
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13-33. Internal Signals Multiplexed on OBSMUX3
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143
SWPU177N – December 2009 – Revised November 2010
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