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A.9.1
sDMA Environment
............................................................................................
A.9.2
sDMA Integration
..............................................................................................
A.9.2.1
DMA Requests to the sDMA Controller
..............................................................
A.10
Interrupt Controller
.....................................................................................................
A.10.1
Interrupt Controller Overview
...............................................................................
A.10.2
MPU Subsystem INTC Integration
.........................................................................
A.10.3
Interrupt Controller Use Guidelines
........................................................................
A.11
System Control Module
................................................................................................
A.11.1
SCM Environment
............................................................................................
A.11.2
Pad Multiplexing Register Fields
...........................................................................
A.11.3
SCM Use Guidelines
........................................................................................
A.12
Multimaster High-Speed I
2
C Controller
..............................................................................
A.12.1
HS I
2
C Use Guidelines
......................................................................................
A.13
UART/IrDA/CIR
.........................................................................................................
A.13.1
UART/IrDA/CIR Use Guidelines
............................................................................
A.14
Multichannel SPI
........................................................................................................
A.14.1
McSPI Use Guidelines
......................................................................................
A.15
Multichannel Buffered Serial Port
....................................................................................
A.15.1
McBSP Overview
.............................................................................................
A.15.2
McBSP Environment
.........................................................................................
A.15.2.1
McBSP Signal Descriptions
............................................................................
A.15.2.2
McBSP Modes
...........................................................................................
A.15.3
McBSP Use Guidelines
.....................................................................................
A.16
High-Speed USB Host Subsystem
...................................................................................
A.16.1
Overview
......................................................................................................
A.16.2
High-Speed USB Host Subsystem Use Guidelines
.....................................................
A.17
General-Purpose Interface
............................................................................................
A.17.1
General-Purpose Interface Overview
......................................................................
A.17.2
General-Purpose Interface Environment
..................................................................
A.18
Initialization
..............................................................................................................
A.18.1
Overview
......................................................................................................
A.18.2
Preinitialization
...............................................................................................
A.18.2.1
Power Connections
.....................................................................................
A.18.3
Clock and Reset
..............................................................................................
A.18.4
Boot Configuration
...........................................................................................
B
OMAP36xx Multimedia Device in CUS Package
..................................................................
B.1
Overview
.................................................................................................................
B.2
Description
..............................................................................................................
B.3
Unsupported Modules
..................................................................................................
B.4
Functional Restrictions
.................................................................................................
B.4.1
Camera Image Signal Processor
............................................................................
B.4.2
Display Subsystem
............................................................................................
B.4.3
GPMC
...........................................................................................................
B.4.4
UART/IrDA/CIR
................................................................................................
B.4.5
Multichannel SPI
...............................................................................................
B.4.6
Multichannel Buffered Serial Port
...........................................................................
B.4.7
High-Speed USB Host Subsystem
..........................................................................
B.4.8
General-Purpose Interface
...................................................................................
B.5
Control Module Pad Multiplexing Register Fields
..................................................................
C
Glossary
.......................................................................................................................
57
SWPU177N – December 2009 – Revised November 2010
Contents
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