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1. The IO pad states are undefined until V
DD
rises sufficiently to enable the POR circuits. The level at which this occurs will
vary from device to device, but for reference it is approximately 700 mV. After POR circuits are enabled, the IO pad states
are high impedance with weak pull devices disabled until POR release
2. While in reset, the pin behavior is same apart from reset pin. Chip drives pad low via obe=1, pue=0, till reset sequence is
complete to indicate reset to off-chip connected devices.
4.5 Signal Multiplexing sheet
IO Signal Description Input Multiplexing sheet(s) attached to the Reference Manual
contains information on pins/balls of this device.
The 'IO Signal Table' and 'Input Muxing' tabs in the sheet correspond to the signal
multiplexing information. The 'IO Signal Table' consists of all the pin muxing details and
the 'Input Muxing' specifies the priority for the input muxing where an input path is
driven by more than one pad.
WCT101xS variant specific IO Signal Description Input Multiplexing sheets attached to
the Reference Manual contains information about the pins/balls of the particular variant.
Module functionality is dependent on the availability of functional pins in a particular
package.
4.5.1 IO Signal Table
Following is an example snippet of IO Signal Table. For selecting any functionality, the
pad PCR register (refer to PORT_PCRn) needs to be configured accordingly.
Figure 4-3. IO signal table snippet
The columns of the above figure are described below:
• Port: This field in IO Signal Table specifies the PAD names of the device.
• CR(Control Register): This field specifies the name of PCR corresponding to the Port
field. On this device there are five PORT instances, namely, PTA, PTB, PTC, PTD
and PTE. Each pad has a corresponding Control Register, referred to as PCR_PTXn
Signal Multiplexing sheet
MWCT101xS Series Reference Manual, Rev. 3, 07/2019
74
NXP Semiconductors
Summary of Contents for MWCT101 S Series
Page 2: ...MWCT101xS Series Reference Manual Rev 3 07 2019 2 NXP Semiconductors...
Page 42: ...MWCT101xS Series Reference Manual Rev 3 07 2019 42 NXP Semiconductors...
Page 50: ...Conventions MWCT101xS Series Reference Manual Rev 3 07 2019 50 NXP Semiconductors...
Page 70: ...Aliased bit band regions MWCT101xS Series Reference Manual Rev 3 07 2019 70 NXP Semiconductors...
Page 78: ...Pinout diagrams MWCT101xS Series Reference Manual Rev 3 07 2019 78 NXP Semiconductors...
Page 96: ...WCT101xS safety concept MWCT101xS Series Reference Manual Rev 3 07 2019 96 NXP Semiconductors...
Page 130: ...Functional description MWCT101xS Series Reference Manual Rev 3 07 2019 130 NXP Semiconductors...
Page 284: ...Functional description MWCT101xS Series Reference Manual Rev 3 07 2019 284 NXP Semiconductors...
Page 430: ...Functional Description MWCT101xS Series Reference Manual Rev 3 07 2019 430 NXP Semiconductors...
Page 472: ...Application Information MWCT101xS Series Reference Manual Rev 3 07 2019 472 NXP Semiconductors...
Page 528: ...Module clocks MWCT101xS Series Reference Manual Rev 3 07 2019 528 NXP Semiconductors...
Page 634: ...SRAM configuration MWCT101xS Series Reference Manual Rev 3 07 2019 634 NXP Semiconductors...
Page 818: ...Functional description MWCT101xS Series Reference Manual Rev 3 07 2019 818 NXP Semiconductors...
Page 960: ...Functional description MWCT101xS Series Reference Manual Rev 3 07 2019 960 NXP Semiconductors...
Page 992: ...ADC calibration scheme MWCT101xS Series Reference Manual Rev 3 07 2019 992 NXP Semiconductors...
Page 1348: ...Functional description MWCT101xS Series Reference Manual Rev 3 07 2019 1348 NXP Semiconductors...
Page 1366: ...Functional description MWCT101xS Series Reference Manual Rev 3 07 2019 1366 NXP Semiconductors...
Page 1514: ...Functional description MWCT101xS Series Reference Manual Rev 3 07 2019 1514 NXP Semiconductors...
Page 1726: ...Debug and security MWCT101xS Series Reference Manual Rev 3 07 2019 1726 NXP Semiconductors...
Page 1760: ...MWCT101xS Series Reference Manual Rev 3 07 2019 1760 NXP Semiconductors...