Description Input Multiplexing sheet(s) attached with
Reference Manual.
EEPROM emulated by FlexRAM
1
FlexRAM (also available as system RAM)
Cache
System RAM (including FlexRAM)
Flash
Single supply voltage
Watchdog
Number of I/Os
Memory protection unit
Parameter
Peripheral speed
CRC module
IEEE-754 FPU
Core
EWM
DMA
Crossbar
ISO 26262
HW security module (CSEc)
1
Frequency
Error correction code (ECC)
Low power timer (LPTMR)
Low power interrupt timer
LEGEND:
Not implemented
Available on the device
1 No write or erase access to Flash module, including Security (CSEc) and EEPROM commands, are allowed when
device is running at HSRUN mode (112MHz) or VLPR mode.
2 Available when EEEPROM, CSEc and Data Flash are not used. Else only up to 1,984 KB is available for Program Flash.
3 4 KB (up to 512 KB D-Flash as a part of 2M Flash). Up to 64 KB of flash is used as EEPROM backup and the remaining 448 KB
of the last 512 KB block can be used as Data flash or Program flash. See chapter FTFC for details.
4 Only for Boundary Scan Register
5 See Dimensions for package drawing
Trigger mux (TRGMUX)
Real time counter (RTC)
FlexTimer (16-bit counter) 8 channels
External memory interface
12-bit SAR ADC (1 MSPS each)
FlexIO (8 pins configurable as UART, SPI, I2C, I2S)
Low power I2C
Debug & trace
Packages
5
Ecosystem
(IDE, compiler, debugger)
FlexCAN
(CAN-FD ISO/CD 11898-1)
Low power SPI
Comparator with 8-bit DAC
Programmable delay block (PDB)
MWCT101xS
MWCT1014S
MWCT1015S
MWCT1016S
1x
SWD, JTAG
4
(ITM, SWV, SWO)
NXP S32 Design GCC + GHS + Lauterbach
LQFP-64
LQFP-100
SWD, JTAG
(ITM, SWV,
SWO), ETM
1x (64)
2x (16)
2x (24)
2x (32)
3x
1x
2x
3x
(2x with FD)
3x
(3x with FD)
3x
(1x with FD)
1x
1x (73)
1x (81)
up to 112 MHz (HSRUN)
1x
Arm
®
Cortex
™
-M4F
1x
capable up to ASIL-B
up to 112 MHz (HSRUN)
4 KB (up to 64 KB D-Flash)
4 KB
4 KB
64 KB
128 KB
256 KB
-40 to +105ºC / +125ºC
512 KB
1 MB
2 MB
2
2.7 - 5.5 V
up to 89
up to 89
up to 89
1x
1x
1x
4x (32)
6x (48)
8x (64)
QuadSPI incl.
HyperBus™
2x
Memory
Analog
Timer
Communication
IDEs
Other
System
Operating temperature (Ta) Temperature ambient
FIRC CMU
Low power modes
LQFP-100
BGA-100
BGA-100
See footnote 3
Low power UART/LIN
(Supports LIN protocol versions 1.3, 2.0, 2.1, 2.2A and SAE J2602)
3x
HSRUN mode
1
Figure 2-2. MWCT101xS product series comparison
Chapter 2 Introduction
MWCT101xS Series Reference Manual, Rev. 3, 07/2019
NXP Semiconductors
57
Summary of Contents for MWCT101 S Series
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Page 50: ...Conventions MWCT101xS Series Reference Manual Rev 3 07 2019 50 NXP Semiconductors...
Page 70: ...Aliased bit band regions MWCT101xS Series Reference Manual Rev 3 07 2019 70 NXP Semiconductors...
Page 78: ...Pinout diagrams MWCT101xS Series Reference Manual Rev 3 07 2019 78 NXP Semiconductors...
Page 96: ...WCT101xS safety concept MWCT101xS Series Reference Manual Rev 3 07 2019 96 NXP Semiconductors...
Page 130: ...Functional description MWCT101xS Series Reference Manual Rev 3 07 2019 130 NXP Semiconductors...
Page 284: ...Functional description MWCT101xS Series Reference Manual Rev 3 07 2019 284 NXP Semiconductors...
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Page 472: ...Application Information MWCT101xS Series Reference Manual Rev 3 07 2019 472 NXP Semiconductors...
Page 528: ...Module clocks MWCT101xS Series Reference Manual Rev 3 07 2019 528 NXP Semiconductors...
Page 634: ...SRAM configuration MWCT101xS Series Reference Manual Rev 3 07 2019 634 NXP Semiconductors...
Page 818: ...Functional description MWCT101xS Series Reference Manual Rev 3 07 2019 818 NXP Semiconductors...
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Page 992: ...ADC calibration scheme MWCT101xS Series Reference Manual Rev 3 07 2019 992 NXP Semiconductors...
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Page 1514: ...Functional description MWCT101xS Series Reference Manual Rev 3 07 2019 1514 NXP Semiconductors...
Page 1726: ...Debug and security MWCT101xS Series Reference Manual Rev 3 07 2019 1726 NXP Semiconductors...
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