Should a dynamic scatter/gather attempt fail, setting the DREQ bit will prevent a
future hardware activation of this channel. This stops the channel from executing
with a destination address (DADDR) that was calculated using a scatter/gather
address (written in the next step) instead of a dlast final offset value.
3. Write the
register with the scatter/gather address.
4. Write 1b to the TCDn_CSR[ESG] bit.
5. Read back the 16 bit TCD control/status field.
6. Test the ESG request status and MAJORLINKCH value in the TCDn_CSR register:
If ESG = 1b, the dynamic link attempt was successful.
If ESG = 0b and the MAJORLINKCH (ID) did not change, the attempted dynamic
link did not succeed (the channel was already retiring).
If ESG = 0b and the MAJORLINKCH (ID) changed, the dynamic link attempt was
successful (the new TCD’s E_SG value cleared the ESG bit).
16.6.7.3.2 Method 2 (channel using major loop channel linking)
For a channel using major loop channel linking, the coherency model described here may
be used for a dynamic scatter/gather request. This method uses the TCD.DLAST_SGA
field as a TCD identification (ID).
1. Write 1b to the
Should a dynamic scatter/gather attempt fail, setting the DREQ bit will prevent a
future hardware activation of this channel. This stops the channel from executing
with a destination address (DADDR) that was calculated using a scatter/gather
address (written in the next step) instead of a dlast final offset value.
2. Write the
register with the scatter/gather address.
3. Write 1b to the TCDn_CSR[ESG] bit.
4. Read back the ESG bit.
5. Test the ESG request status:
If ESG = 1b, the dynamic link attempt was successful.
If ESG = 0b, read the 32 bit TCDn_DLASTSGA field.
If ESG = 0b and the TCDn_DLASTSGA did not change, the attempted dynamic link
did not succeed (the channel was already retiring).
Initialization/application information
MWCT101xS Series Reference Manual, Rev. 3, 07/2019
370
NXP Semiconductors
Summary of Contents for MWCT101 S Series
Page 2: ...MWCT101xS Series Reference Manual Rev 3 07 2019 2 NXP Semiconductors...
Page 42: ...MWCT101xS Series Reference Manual Rev 3 07 2019 42 NXP Semiconductors...
Page 50: ...Conventions MWCT101xS Series Reference Manual Rev 3 07 2019 50 NXP Semiconductors...
Page 70: ...Aliased bit band regions MWCT101xS Series Reference Manual Rev 3 07 2019 70 NXP Semiconductors...
Page 78: ...Pinout diagrams MWCT101xS Series Reference Manual Rev 3 07 2019 78 NXP Semiconductors...
Page 96: ...WCT101xS safety concept MWCT101xS Series Reference Manual Rev 3 07 2019 96 NXP Semiconductors...
Page 130: ...Functional description MWCT101xS Series Reference Manual Rev 3 07 2019 130 NXP Semiconductors...
Page 284: ...Functional description MWCT101xS Series Reference Manual Rev 3 07 2019 284 NXP Semiconductors...
Page 430: ...Functional Description MWCT101xS Series Reference Manual Rev 3 07 2019 430 NXP Semiconductors...
Page 472: ...Application Information MWCT101xS Series Reference Manual Rev 3 07 2019 472 NXP Semiconductors...
Page 528: ...Module clocks MWCT101xS Series Reference Manual Rev 3 07 2019 528 NXP Semiconductors...
Page 634: ...SRAM configuration MWCT101xS Series Reference Manual Rev 3 07 2019 634 NXP Semiconductors...
Page 818: ...Functional description MWCT101xS Series Reference Manual Rev 3 07 2019 818 NXP Semiconductors...
Page 960: ...Functional description MWCT101xS Series Reference Manual Rev 3 07 2019 960 NXP Semiconductors...
Page 992: ...ADC calibration scheme MWCT101xS Series Reference Manual Rev 3 07 2019 992 NXP Semiconductors...
Page 1348: ...Functional description MWCT101xS Series Reference Manual Rev 3 07 2019 1348 NXP Semiconductors...
Page 1366: ...Functional description MWCT101xS Series Reference Manual Rev 3 07 2019 1366 NXP Semiconductors...
Page 1514: ...Functional description MWCT101xS Series Reference Manual Rev 3 07 2019 1514 NXP Semiconductors...
Page 1726: ...Debug and security MWCT101xS Series Reference Manual Rev 3 07 2019 1726 NXP Semiconductors...
Page 1760: ...MWCT101xS Series Reference Manual Rev 3 07 2019 1760 NXP Semiconductors...