Table 41-13. Software ouput control behavior when (COMP = 1)
CH(n)OC
CH(n+1)OC
CH(n)OCV
CH(n+1)OCV
Channel (n) Output
Channel (n+1) Output
0
0
X
X
is not modified by SWOC
is not modified by SWOC
1
1
0
0
is forced to zero
is forced to zero
1
1
0
1
is forced to zero
is forced to one
1
1
1
0
is forced to one
is forced to zero
1
1
1
1
is forced to one
is forced to zero
Note
• The CH(n)OC and CH(n+1)OC bits should be equal.
• The COMP bit must not be modified when software output
control is enabled, that is, CH(n)OC = 1 and/or CH(n
+1)OC = 1.
• Software output control has the same behavior with
disabled or enabled FTM counter (see the CLKS field
description in the Status and Control register).
41.5.16 Deadtime insertion
The deadtime insertion is enabled when DTEN is set and the concatenation
{DTVALEX[3:0], DTVAL[5:0]} is non-zero.
DEADTIME register defines the deadtime delay that can be used for all FTM channels.
The clock for the DEADTIME delay is the FTM input clock divided by DTPS bits, and
the {DTVALEX[3:0], DTVAL[5:0]} bits define the deadtime modulo, that is, the
number of the deadtime prescaler clocks.
The deadtime delay insertion ensures that no two complementary signals (channels (n)
and (n+1)) drive the active state at the same time.
If POL(n) = 0, POL(n+1) = 0, and the deadtime is enabled, then when the channel (n)
match (FTM counter = C(n)V) occurs, the channel (n) output remains at the low value
until the end of the deadtime delay when the channel (n) output is set. Similarly, when the
channel (n+1) match (FTM counter = C(n+1)V) occurs, the channel (n+1) output remains
at the low value until the end of the deadtime delay when the channel (n+1) output is set.
See the following figures.
If POL(n) = 1, POL(n+1) = 1, and the deadtime is enabled, then when the channel (n)
match (FTM counter = C(n)V) occurs, the channel (n) output remains at the high value
until the end of the deadtime delay when the channel (n) output is cleared. Similarly,
Chapter 41 FlexTimer Module (FTM)
MWCT101xS Series Reference Manual, Rev. 3, 07/2019
NXP Semiconductors
1241
Summary of Contents for MWCT101 S Series
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Page 50: ...Conventions MWCT101xS Series Reference Manual Rev 3 07 2019 50 NXP Semiconductors...
Page 70: ...Aliased bit band regions MWCT101xS Series Reference Manual Rev 3 07 2019 70 NXP Semiconductors...
Page 78: ...Pinout diagrams MWCT101xS Series Reference Manual Rev 3 07 2019 78 NXP Semiconductors...
Page 96: ...WCT101xS safety concept MWCT101xS Series Reference Manual Rev 3 07 2019 96 NXP Semiconductors...
Page 130: ...Functional description MWCT101xS Series Reference Manual Rev 3 07 2019 130 NXP Semiconductors...
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Page 472: ...Application Information MWCT101xS Series Reference Manual Rev 3 07 2019 472 NXP Semiconductors...
Page 528: ...Module clocks MWCT101xS Series Reference Manual Rev 3 07 2019 528 NXP Semiconductors...
Page 634: ...SRAM configuration MWCT101xS Series Reference Manual Rev 3 07 2019 634 NXP Semiconductors...
Page 818: ...Functional description MWCT101xS Series Reference Manual Rev 3 07 2019 818 NXP Semiconductors...
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Page 992: ...ADC calibration scheme MWCT101xS Series Reference Manual Rev 3 07 2019 992 NXP Semiconductors...
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Page 1514: ...Functional description MWCT101xS Series Reference Manual Rev 3 07 2019 1514 NXP Semiconductors...
Page 1726: ...Debug and security MWCT101xS Series Reference Manual Rev 3 07 2019 1726 NXP Semiconductors...
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