4 - 6
Chapter 4 Installation, Wiring and Maintenance of the Product
[2] Other precautions
(1) Main body
The main body case is made of plastic. Take care not to drop or apply
strong impacts onto the case.
Do not remove the PCB of Simple Motion module from the case. Failure
to observe this could lead to faults.
Before touching the module, always touch grounded metal, etc. to
discharge static electricity from human body. Failure to do so may cause
the module to fail or malfunction.
Handle the module carefully. In order to protect the module, place the
module in a horizontal position when the module is on a desk or cart.
P U L S E R
CN1
P
U
L
S
E
R
P
U
L
S
E
R
CN1
C
N
1
(2) Cable
Do not press on the cable with a sharp object.
Do not twist the cable with force.
Do not forcibly pull on the cable.
Do not step on the cable.
Do not place objects on the cable.
Do not damage the cable sheath.
(3) Installation environment
Do not install the module in the following type of environment.
Where the ambient temperature exceeds the 0 to 55
°
C (32 to 131
°
F)
range.
Where the ambient humidity exceeds the 5 to 95%RH range.
Where temperature sudden changes and dew condenses.
Where there is corrosive gas or flammable gas.
Where there are high levels of dust, conductive powder, such as iron
chips, oil mist, salt or organic solvents.
Where the module is subject to direct sunlight.
Where there are strong electric fields or magnetic fields.
Where vibration or impact could be directly applied onto the main body.
Summary of Contents for MELSEC-L Series
Page 2: ......
Page 30: ...MEMO ...
Page 70: ...2 10 Chapter 2 System Configuration MEMO ...
Page 83: ...3 13 Chapter 3 Specifications and Functions MEMO ...
Page 103: ...3 33 Chapter 3 Specifications and Functions MEMO ...
Page 107: ...3 37 Chapter 3 Specifications and Functions MEMO ...
Page 111: ...3 41 Chapter 3 Specifications and Functions MEMO ...
Page 115: ...3 45 Chapter 3 Specifications and Functions MEMO ...
Page 140: ...4 22 Chapter 4 Installation Wiring and Maintenance of the Product MEMO ...
Page 253: ...5 113 Chapter 5 Data Used for Positioning Control MEMO ...
Page 342: ...5 202 Chapter 5 Data Used for Positioning Control MEMO ...
Page 438: ...7 20 Chapter 7 Memory Configuration and Data Process MEMO ...
Page 440: ...MEMO ...
Page 485: ...9 25 Chapter 9 Major Positioning Control MEMO ...
Page 594: ...9 134 Chapter 9 Major Positioning Control MEMO ...
Page 624: ...10 30 Chapter 10 High Level Positioning Control MEMO ...
Page 656: ...11 32 Chapter 11 Manual Control MEMO ...
Page 690: ...12 34 Chapter 12 Expansion Control MEMO ...
Page 798: ...13 108 Chapter 13 Control Sub Functions MEMO ...
Page 866: ...14 68 Chapter 14 Common Functions MEMO ...
Page 884: ...15 18 Chapter 15 Dedicated Instructions MEMO ...
Page 899: ...16 15 Chapter 16 Troubleshooting MEMO ...
Page 1036: ...Appendix 88 Appendices MEMO ...
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