Appendix A MCU Electrical Specifications
S12ZVHY/S12ZVHL Family Reference Manual Rev. 1.05
782
Freescale Semiconductor
Table A-7. Thermal Package Characteristics
1
Num
C
Rating
Symbol
Min
Typ
Max
Unit
LQFP 100
1
D
Thermal resistance 100LQFP, single sided PCB
(1)
1. Junction to ambient thermal resistance,
JA
was simulated to be equivalent to the JEDEC specification JESD51-2 in a
horizontal configuration in natural convection.
JA
—
58
—
C/W
2
D
Thermal resistance 100LQFP, double sided PCB
with 2 internal planes
(2)
2. Junction to ambient thermal resistance,
JA
was simulated to be equivalent to the JEDEC specification JESD51-7 in a
horizontal configuration in natural convection.
JA
—
45
—
C/W
3
D
Junction to Board 100LQFP
JB
—
30
—
C/W
4
D
Junction to Case 100LQFP
4
JC
—
13
—
C/W
144LQFP
5
D
Thermal resistance 144LQFP, single sided PCB
(3)
3. Junction to ambient thermal resistance,
JA
was simulated to be equivalent to the JEDEC specification JESD51-2 in a
horizontal configuration in natural convection.
JA
—
50
—
C/W
6
D
Thermal resistance 144LQFP, double sided PCB
with 2 internal planes
(4)
4. Junction to ambient thermal resistance,
JA
was simulated to be equivalent to the JEDEC specification JESD51-7 in a
horizontal configuration in natural convection.
JA
—
41
—
C/W
7
D
Junction to Board 144LQFP
JB
—
29
—
C/W
8
D
Junction to Case 144LQFP
4
JC
—
11
—
C/W
1. The values for thermal resistance are achieved by package simulations