Appendix A MCU Electrical Specifications
S12ZVHY/S12ZVHL Family Reference Manual Rev. 1.05
780
Freescale Semiconductor
NOTE
Please refer to the temperature rating of the device with regards to the
ambient temperature T
A
and the junction temperature T
J
. For power
dissipation calculations refer to
Section A.1.7, “Power Dissipation and
.
NOTE
Operation is guaranteed when powering down until low voltage reset
assertion.
A.1.7
Power Dissipation and Thermal Characteristics
Power dissipation and thermal characteristics are closely related. The user must assure that the maximum
operating junction temperature is not exceeded. The average chip-junction temperature (T
J
) in
C can be
obtained from:
Table A-5. Operating Conditions
Num
Rating
Symbol
Min
Typ
Max
Unit
1
Voltage regulator supply
V
SUP
5.5
12
40
(1)
1. Normal operating range is 6V - 18V. Continuos operation at 40V is not allowed. Only Transient Conditions (Load Dump)
single pulse t
max
<400ms
V
2
main Oscillator
f
osc
4
—
20
MHz
3
32K Oscillator
f
osc32k
32
—
40
KHz
4
Bus frequency
f
bus
see
Footnote
(2)
2. Minimum bus frequency for ADC module refer to fADCCLK and for Flash program and erase please refer to f
NVMOP
—
32
MHz
5
Bus frequency without flash wait states
f
WSTAT
see
Footnote
(3)
3. Minimum bus frequency for ADC module refer to fADCCLK and for Flash program and erase please refer to f
NVMOP
—
25
MHz
6
C
Operating junction temperature range
Operating ambient temperature range
(4)
4. Please refer to
Section A.1.7, “Power Dissipation and Thermal Characteristics”
for more details about the relation between
ambient temperature T
A
and device junction temperature T
J
.
T
J
T
A
–40
–40
—
—
130
85
C
7
V
Operating junction temperature range
Operating ambient temperature range
(5)
5. Please refer to
Section A.1.7, “Power Dissipation and Thermal Characteristics”
for more details about the relation between
ambient temperature T
A
and device junction temperature T
J
.
T
J
T
A
–40
–40
—
—
150
105
C
TJ TA PD
JA
+
=
TJ Junction Temperature, [
C
=
TA Ambient Temperature, [
C
=
PD Total Chip Power Dissipation, [W]
=
JA
Package Thermal Resistance, [
C/W]
=
