Mitsubishi Melsec-Q QD75D1, User Manual

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MELSEC-Q
4 INSTALLATION, WIRING AND MAINTENANCE OF THE PRODUCT
[2] Other precautions
(1) Main body
•
The main body case is made of plastic. Take care not to drop or apply
strong impacts onto the case.
•
Do not remove the QD75 PCB from the case. Failure to observe this
could lead to faults.
(2) Cable
•
Do not press on the cable with a sharp object.
• Do not twist the cable with force.
•
Do not forcibly pull on the cable.
•
Do not step on the cable.
• Do not place objects on the cable.
•
Do not damage the cable sheath.
(3) Installation environment
Do not install the module in the following type of environment.
•
Where the ambient temperature exceeds the 0 to 55°C range.
•
Where the ambient humidity exceeds the 5 to 95%RH range.
•
Where there is sudden temperature changes, or where dew condenses.
• Where there is corrosive gas or flammable gas.
•
Where there are high levels of dust, conductive powder, such as iron
chips, oil mist, salt or organic solvents.
• Where the module will be subject to direct sunlight.
•
Where there are strong electric fields or magnetic fields.
•
Where vibration or impact could be directly applied onto the main body.