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MELSEC-Q
5 DATA USED FOR POSITIONING CONTROL
Da.15 Condition target
Set the condition target as required for each control.
Setting value
Setting details
01
H
: Device X
02
H
: Device Y
Set the input/output signal ON/OFF of the QD75 as the
conditions.
03
H
: Buffer memory (1-word)
04
H
: Buffer memory (2-word)
Set the value stored in the buffer memory as the condition.
03
H
: The target buffer memory is "1-word (16 bits)"
04
H
: The target buffer memory is "2-word (32 bits)"
05
H
: Positioning data No.
Select only for "simultaneous start".
Da.16 Condition operator
Set the condition operator as required for the "
Da.15
Condition target".
Da.15
Condition target
Setting value
Setting details
07
H
: DEV=ON
01
H
: Device X
02
H
: Device Y
08
H
: DEV=OFF
The state (ON/OFF) of an I/O signal is defined as the
condition. Select ON or OFF as the trigger.
01
H
:
∗∗
=P1
02
H
:
∗∗≠
P1
03
H
:
∗∗≤
P1
04
H
:
∗∗≥
P1
05
H
: P1
≤∗∗≤
P2
03
H
: Buffer memory (1-word)
04
H
: Buffer memory (2-word)
06
H
:
∗∗≤
P1, P2
≤∗∗
Select how to use the value (
∗∗
) in the buffer memory
as a part of the condition.
10
H
: Axis 1 selected
20
H
: Axis 2 selected
30
H
: Axes 1 and 2 selected
40
H
: Axis 3 selected
50
H
: Axes 1 and 3 selected
60
H
: Axes 2 and 3 selected
70
H
: Axes 1, 2, and 3 selected
80
H
: Axis 4 selected
90
H
: Axes 1 and 4 selected
A0
H
: Axes 2 and 4 selected
B0
H
: Axes 1, 2, and 4 selected
C0
H
: Axes 3 and 4 selected
D0
H
: Axes 1, 3, and 4 selected
05
H
: Positioning data No.
E0
H
: Axes 2, 3, and 4 selected
If "simultaneous start" is specified, select the axis
(or axes) that should start simultaneously.
Da.17 Address
Set the address as required for the "
Da.15
Condition target".
Da.15
Condition target
Setting value
Setting details
01
H
:
Device X
02
H
:
Device Y
–
Not used. (There is no need to set.)
03
H
:
Buffer memory (1-word)
04
H
:
Buffer memory (2-word)
Value
(Buffer memory address)
Set the target "buffer memory address".
(For 2 word, set the low-order buffer memory
address.)
05
H
:
Positioning data No.
–
Not used. (There is no need to set.)
Summary of Contents for Melsec-Q QD75D1
Page 1: ......
Page 2: ......
Page 22: ...A 20 MEMO ...
Page 24: ...MEMO ...
Page 41: ...1 17 MELSEC Q 1 PRODUCT OUTLINE MEMO ...
Page 48: ...1 24 MELSEC Q 1 PRODUCT OUTLINE MEMO ...
Page 60: ...2 12 MELSEC Q 2 SYSTEM CONFIGURATION MEMO ...
Page 137: ...5 33 MELSEC Q 5 DATA USED FOR POSITIONING CONTROL MEMO ...
Page 232: ...5 128 MELSEC Q 5 DATA USED FOR POSITIONING CONTROL MEMO ...
Page 252: ...6 20 MELSEC Q 6 SEQUENCE PROGRAM USED FOR POSITIONING CONTROL ...
Page 253: ...6 21 MELSEC Q 6 SEQUENCE PROGRAM USED FOR POSITIONING CONTROL ...
Page 278: ...6 46 MELSEC Q 6 SEQUENCE PROGRAM USED FOR POSITIONING CONTROL MEMO ...
Page 292: ...MEMO ...
Page 436: ...9 120 MELSEC Q 9 MAJOR POSITIONING CONTROL MEMO ...
Page 464: ...10 28 MELSEC Q 10 HIGH LEVEL POSITIONING CONTROL MEMO ...
Page 638: ...14 24 MELSEC Q 14 DEDICATED INSTRUCTIONS MEMO ...
Page 647: ...15 9 MELSEC Q 15 TROUBLESHOOTING MEMO ...
Page 686: ...15 48 MELSEC Q 15 TROUBLESHOOTING MEMO ...
Page 839: ...Appendix 153 MELSEC Q APPENDICES 6 QD75D4N 90 23 27 4 12 98 4 46 Unit mm ...
Page 840: ...Appendix 154 MELSEC Q APPENDICES 7 QD75P1 QD75P2 QD75P4 27 4 23 98 90 4 46 unit mm ...
Page 841: ...Appendix 155 MELSEC Q APPENDICES 8 QD75D1 QD75D2 QD75D4 27 4 23 90 12 98 4 46 unit mm ...
Page 842: ...Appendix 156 MELSEC Q APPENDICES MEMO ...
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