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Rockwell Automation Publication 2198-UM002E-EN-P - February 2018
Chapter 2
Plan the Kinetix 5700 Drive System Installation
In multi-axis shared-bus configurations, drive modules must be spaced by
aligning the zero-stack tab and cutout.
Figure 15 - Multi-axis Shared-bus Clearance Requirements
Electrical Noise Reduction
This section outlines best practices that minimize the possibility of noise-
related failures as they apply specifically to Kinetix 5700 system installations.
For more information on the concept of high-frequency (HF) bonding, the
ground plane principle, and electrical noise reduction, refer to the System
Design for Control of Electrical Noise Reference Manual, publication
Bonding Modules
Bonding is the practice of connecting metal chassis, assemblies, frames, shields,
and enclosures to reduce the effects of electromagnetic interference (EMI).
Unless specified, most paints are not conductive and act as insulators. To
achieve a good bond between the drive module and subpanel, surfaces need to
be paint-free or plated. Bonding metal surfaces creates a low-impedance return
path for high-frequency energy.
Improper bonding of metal surfaces blocks the direct return path and allows
high-frequency energy to travel elsewhere in the cabinet. Excessive high-
frequency energy can effect the operation of other microprocessor controlled
equipment.
MOD
NET
MOD
NET
MOD
NET
Zero-stack Tab and
Cutout Aligned
Shared-bus connection system
is not shown for clarity.
IMPORTANT
To improve the bond between the drive module and subpanel, construct
your subpanel out of zinc plated (paint-free) steel.