![NXP Semiconductors SAFE ASSURE Qorivva MPC5601P Reference Manual Download Page 819](http://html.mh-extra.com/html/nxp-semiconductors/safe-assure-qorivva-mpc5601p/safe-assure-qorivva-mpc5601p_reference-manual_1721898819.webp)
Chapter 33 Boot Assist Module (BAM)
MPC5602P Microcontroller Reference Manual, Rev. 4
Freescale Semiconductor
819
•
PAD A[2] - ABS[0],
•
PAD A[3] - ABS[1],
•
PAD A[4] - FAB
NOTE
PAD A[2] - ABS[0] is not bonded on MPC5602P 64-pin LQFP package so
for this package the option 'FlexCAN without Autobaud ' is not available
and the internal pull-down on PAD A[2] assures that it is at low logical value
at reset.
33.5.2
MPC5602P boot pins
The TX/RX pin (LINFlex_0 and FlexCAN_0) used for serial boot and configuration boot pins to select
the serial boot mode are described in the
for 64-pin and 100-pin LQFP packages.
Table 33-2. Hardware configuration to select boot mode
FAB
ABS[1:0]
1
1
During reset the boot configuration pins are weak pull down.
Standby-RAM
Boot Flag
Boot ID
Boot Mode
1
00
0
—
LINFlex without autobaud
1
01
0
—
FlexCAN without autobaud
1
10
0
—
Autobaud scan
Table 33-3. MPC5602P boot pins
Port pin
Function
Pin
64-pin
100-pin
A[2]
1
1
Weak pull down during reset.
ABS[0]
—
57
A[3]
ABS[1]
41
64
A[4]
FAB
48
75
B[0]
CAN_0 TX
49
76
B[1]
CAN_0 RX
50
77
B[2]
LIN_0 TX
51
79
B[3]
2
2
MPC5602P 100-pin LQFP package uses only PAD B[3] - pin 80 for boot via LINFLEX.
LIN_0 RX
—
80
B[7]
3
3
MPC5602P 64-pin LQFP package uses only PAD B[7] - pin 20 for boot via LINFLEX.
CAN_0 RX
20
29