Table 47-17. Device and Package Maximum Weight
140
mg
Table 47-18. Package Characteristics
Moisture Sensitivity Level
MSL3
Table 47-19. Package Reference
JEDEC Drawing Reference
MO-220
JESD97 Classification
E3
47.3. Soldering Profile
The following table gives the recommended soldering profile from J-STD-20.
Table 47-20.
Profile Feature
Green Package
Average Ramp-up Rate (217°C to peak)
3°C/s max.
Preheat Temperature 175°C ±25°C
150-200°C
Time Maintained Above 217°C
60-150s
Time within 5°C of Actual Peak Temperature
30s
Peak Temperature Range
260°C
Ramp-down Rate
6°C/s max.
Time 25°C to Peak Temperature
8 minutes max.
A maximum of three reflow passes is allowed per component.
Atmel SAM L22G / L22J / L22N [DATASHEET]
Atmel-42402E-SAM L22G / L22J / L22N_Datasheet_Complete-07/2016
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