Table 47-15. Package Characteristics
Moisture Sensitivity Level
MSL3
Table 47-16. Package Reference
JEDEC Drawing Reference
MS-026
JESD97 Classification
E3
47.2.6. 48 pin QFN
Note:
The exposed die attach pad is not connected electrically inside the device.
Atmel SAM L22G / L22J / L22N [DATASHEET]
Atmel-42402E-SAM L22G / L22J / L22N_Datasheet_Complete-07/2016
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