3 General Safety Precautions and Usage Considerations
3-13
(2) Using medium infrared ray reflow
•
Heating top and bottom with long or medium infrared rays is recommended (see Figure 3).
Long infrared ray heater (preheating)
Medium infrared ray heater
(reflow)
Product flow
Figure 3 Heating top and bottom with long or medium infrared rays
•
Complete the infrared ray reflow process from 30 to 50 seconds at a package surface temperature of between
210°C and 260°C.
•
Refer to Figure 4 for an example of a good temperature profile for infrared or hot air reflow.
230
30-50 s
Time (s)
60-120 s
(°C)
260
190
180
P
a
ckage
surface tem
p
erature
Figure 4 Sample temperature profile for infrared or hot air reflow
(3) Using hot air reflow
•
Complete hot air reflow from 30 to 50 seconds at a package surface temperature of between 230°C and
260°C.
•
For an example of a recommended temperature profile, refer to Figure 4 above.
3.5.4
Flux cleaning and ultrasonic cleaning
(1) When cleaning circuit boards to remove flux, make sure that no residual reactive ions such as Na or Cl
remain. Note that organic solvents react with water to generate hydrogen chloride and other corrosive gases
which can degrade device performance.
(2) Washing devices with water will not cause any problems. However, make sure that no reactive ions such as
sodium and chlorine are left as a residue. Also, be sure to dry devices sufficiently after washing.
(3) Do not rub device markings with a brush or with your hand during cleaning or while the devices are still
wet from the cleaning agent. Doing so can rub off the markings.
Содержание TMPR4925
Страница 1: ...64 Bit TX System RISC TX49 Family TMPR4925 Rev 3 0 ...
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Страница 15: ...Handling Precautions ...
Страница 16: ......
Страница 18: ...1 Using Toshiba Semiconductors Safely 1 2 ...
Страница 40: ...3 General Safety Precautions and Usage Considerations 3 18 ...
Страница 42: ...4 Precautions and Usage Considerations 4 2 ...
Страница 43: ...TMPR4925 ...
Страница 44: ......
Страница 54: ...Chapter 1 Features 1 8 ...
Страница 58: ...Chapter 2 Block Diagram 2 4 ...
Страница 88: ...Chapter 4 Address Mapping 4 12 ...
Страница 226: ...Chapter 8 DMA Controller 8 58 ...
Страница 260: ...Chapter 9 SDRAM Controller 9 34 ...
Страница 480: ...Chapter 15 Interrupt Controller 15 32 ...
Страница 554: ...Chapter 19 Real Time Clock RTC 19 8 ...
Страница 555: ...Chapter 20 Removed 20 1 20 Removed ...
Страница 556: ...Chapter 20 Removed 20 2 ...
Страница 564: ...Chapter 21 Extended EJTAG Interface 21 8 ...
Страница 580: ...Chapter 22 Electrical Characteristics 22 16 ...
Страница 586: ...Chapter 23 Pin Layout Package 23 6 23 2 Package Package Type Package Code 256 pin PBGA PBGA 4L P BGA256 2727 1 27A4 ...
Страница 588: ...Chapter 24 Usage Notes 24 2 ...
Страница 590: ...Appendix A TX49 H2 Core Supplement A 2 ...