3 General Safety Precautions and Usage Considerations
3-4
3.2 Storage
3.2.1 General
storage
•
Avoid storage locations where devices will be exposed to moisture or direct sunlight.
•
Follow the instructions printed on the device cartons regarding
transportation and storage.
•
The storage area temperature should be kept within a temperature range
of 5°C to 35°C, and relative humidity should be maintained at between
45% and 75%.
•
Do not store devices in the presence of harmful (especially corrosive)
gases, or in dusty conditions.
•
Use storage areas where there is minimal temperature fluctuation. Rapid temperature changes can cause
moisture to form on stored devices, resulting in lead oxidation or corrosion. As a result, the solderability of
the leads will be degraded.
•
When repacking devices, use anti-static containers.
•
Do not allow external forces or loads to be applied to devices while they are in storage.
•
If devices have been stored for more than two years, their electrical characteristics should be tested and their
leads should be tested for ease of soldering before they are used.
3.2.2 Moisture-proof
packing
Moisture-proof packing should be handled with care. The handling procedure
specified for each packing type should be followed scrupulously. If the proper
procedures are not followed, the quality and reliability of devices may be degraded.
This section describes general precautions for handling moisture-proof packing. Since
the details may differ from device to device, refer also to the relevant individual
datasheets or databook.
(1) General
precautions
Follow the instructions printed on the device cartons regarding transportation and storage.
•
Do not drop or toss device packing. The laminated aluminum material in it can be rendered ineffective by
rough handling.
•
The storage area temperature should be kept within a temperature range of 5°C to 30°C, and relative humidity
should be maintained at 90% (max). Use devices within 12 months of the date marked on the package seal.
Humidity:
Temperature:
Содержание TMPR4925
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Страница 18: ...1 Using Toshiba Semiconductors Safely 1 2 ...
Страница 40: ...3 General Safety Precautions and Usage Considerations 3 18 ...
Страница 42: ...4 Precautions and Usage Considerations 4 2 ...
Страница 43: ...TMPR4925 ...
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Страница 54: ...Chapter 1 Features 1 8 ...
Страница 58: ...Chapter 2 Block Diagram 2 4 ...
Страница 88: ...Chapter 4 Address Mapping 4 12 ...
Страница 226: ...Chapter 8 DMA Controller 8 58 ...
Страница 260: ...Chapter 9 SDRAM Controller 9 34 ...
Страница 480: ...Chapter 15 Interrupt Controller 15 32 ...
Страница 554: ...Chapter 19 Real Time Clock RTC 19 8 ...
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Страница 556: ...Chapter 20 Removed 20 2 ...
Страница 564: ...Chapter 21 Extended EJTAG Interface 21 8 ...
Страница 580: ...Chapter 22 Electrical Characteristics 22 16 ...
Страница 586: ...Chapter 23 Pin Layout Package 23 6 23 2 Package Package Type Package Code 256 pin PBGA PBGA 4L P BGA256 2727 1 27A4 ...
Страница 588: ...Chapter 24 Usage Notes 24 2 ...
Страница 590: ...Appendix A TX49 H2 Core Supplement A 2 ...