861
11100B–ATARM–31-Jul-12
SAM4S Series [Preliminary]
36.4
Application Block Diagram
Figure 36-2. Application Block Diagram
36.5
Pin Name List
Notes:
1. When several HSMCI (x HSMCI) are embedded in a product, MCCK refers to HSMCIx_CK, MCCDA to HSMCIx_CDA,
MCDAy to HSMCIx_DAy.
2. I: Input, O: Output, PP: Push/Pull, OD: Open Drain.
2 3 4 5 6
1
7
MMC
2 3 4 5 6
1
7 8
SDCard
9
Physical Layer
HSMCI Interface
Application Layer
ex: File System, Audio, Security, etc.
9 1011
1213 8
Table 36-1.
I/O Lines Description for 4-bit Configuration
Pin Description
Type
Comments
MCCDA
Command/response
I/O/PP/OD
CMD of an MMC or SDCard/SDIO
MCCK
Clock
I/O
CLK of an MMC or SD Card/SDIO
MCDA0 - MCDA3
Data 0..3 of Slot A
I/O/PP
DAT[0..3] of an MMC
DAT[0..3] of an SD Card/SDIO
Summary of Contents for SAM4S Series
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Page 1143: ...1143 11100B ATARM 31 Jul 12 SAM4S Series Preliminary Figure 43 4 64 lead LQFP Package Drawing ...
Page 1145: ...1145 11100B ATARM 31 Jul 12 SAM4S Series Preliminary Figure 43 5 64 lead QFN Package Drawing ...