1147
11100B–ATARM–31-Jul-12
SAM4S Series [Preliminary]
43.1
Soldering Profile
gives the recommended soldering profile from J-STD-020C.
Note:
The package is certified to be backward compatible with Pb/Sn soldering profile.
A maximum of three reflow passes is allowed per component.
43.2
Packaging Resources
Land Pattern Definition.
Refer to the following IPC Standards:
• IPC-7351A and IPC-782 (Generic Requirements for Surface Mount Design and Land Pattern
Standards)
http://landpatterns.ipc.org/default.asp
• Atmel Green and RoHS Policy and Package Material Declaration Data Sheet
Table 43-16. Soldering Profile
Profile Feature
Green Package
Average Ramp-up Rate (217°C to Peak)
3
°
C/sec. max.
Preheat Temperature 175°C ±25°C
180 sec. max.
Temperature Maintained Above 217°C
60 sec. to 150 sec.
Time within 5
°
C of Actual Peak Temperature
20 sec. to 40 sec.
Peak Temperature Range
260
°
C
Ramp-down Rate
6
°
C/sec. max.
Time 25
°
C to Peak Temperature
8 min. max.
Summary of Contents for SAM4S Series
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