Sirona ORTHOPHOS XG 3 DS, Service Manual

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D3352.076.01.13.02 07.2008
5.17 Service routine S032 Tabs 5
S032.10: Test function for sensor in PAN slot
Explanations on the test procedure:
The synchronized readout sequence of the sensor is performed with real data
transmissions and CAN bus commands.
The image data are analyzed in the memory of the DX11.
It is possible to evaluate the LEDs on DX1 (
IMAGE
;
PAN
;
CEPH
) during the
synchronized readout sequence.
IMAGE
-
LED
V501:
Stand By mode = LED dark
Active synchronized readout sequence = LED lights up
CEPH
-
LED
V502:
Sensor in the Ceph slot/Stand By mode = LED lights up
No sensor in the Ceph slot/Stand By mode = LED dark
Sensor in the Ceph slot/active synchronized
readout sequence
= LED dark
PAN
-
LED
V500:
Sensor in the Pan slot/Stand By mode = LED lights up
No sensor in the Pan slot/Stand By mode = LED dark
Sensor in the Pan slot/active synchronized
readout sequence
= LED dark
In addition, "wiggle tests" of cables or ring rotation tests can also be per-
formed.
XG
Plus
: Easypad touchscreen The result of the synchronized readout sequence is displayed:
Image Size = total size of the image
Row Length = image height in pixels
Nr of Rows = Number of image rows
CRC Errors = Number of detected CRC errors during the
synchronized readout sequence
Exp.-Therm TMO = Exposure interrupted by a timeout
while reading image data
Exp.-Therm CRC = Exposure interrupted by an excess
number of CRC errors
V500
Pan V502
Ceph V501
Image
DX1
)
65
HSI-State
Image Size : NOK : 26320
Row Length : OK : 1314
Nr of Rows : NOK : 10
CRC Errors : NOK : 10
Exp.-ThermTMO : NOK : 1
Exp.-ThermCRC : OK : 0
)
65
HSI-State
Image Size : OK : 8134984
Row Length : OK : 2186
Nr of Rows : OK : 1859
CRC Errors : OK : 0
Exp.-ThermTMO : OK : 0
Exp.-ThermCRC : OK : 0