TA B L E O F C O N T E N T S
7/26/00
INTEGRA Operations Revision A
xiv
20-0200-231 (CR), 20-0200-232 (Std), 20-0200-251 (CD)
MODIFY BRUSH CLEANING OPTIONS ................................................................ 9–23
Drip Wafer Count Brush Cleaning................................................................... 9–29
Change DRIP TIME......................................................................................... 9–30
Change DRIP WAFER COUNT...................................................................... 9–31
Change DRIP CHEM ....................................................................................... 9–32
Change DRIP LOW FLOW DI........................................................................ 9–33
Change DRIP HI FLOW DI............................................................................. 9–34
Change Idle Time Brush Cleaning Interval...................................................... 9–35
Change BRUSH IDLE TIME .......................................................................... 9–36
Change BRUSH IDLE ON TIME.................................................................... 9–37
Change BRUSH IDLE OFF TIME .................................................................. 9–38
Change EDGE CLEAN ON TIME .................................................................. 9–39
Change EDGE CLEAN OFF TIME................................................................. 9–40
Change IDLE CHEM ....................................................................................... 9–41
Change IDLE LOW FLOW DI........................................................................ 9–42
Change IDLE HI FLOW DI............................................................................. 9–43
Wafer EFFECT (Brush Conditioning) ............................................................. 9–44
DOSE MODE - 1ST WAFER or ALL WAFERS ........................................... 9–46
Change WAFER IDLE TIME.......................................................................... 9–46
Change WAFER DOSE TIME ........................................................................ 9–47
Change DOSE CHEM...................................................................................... 9–49
Change DOSE LOW FLOW DI....................................................................... 9–49
Change DOSE HI FLOW DI ........................................................................... 9–50
Choose Spin Station EVENT ........................................................................... 9–53
Change UPPER RINSE.................................................................................... 9–53
Change LOWER RINSE.................................................................................. 9–54
Change HEAT LAMP...................................................................................... 9–54
MEGASONIC GENERATOR BUTTONS ................................................................. 9–55
Change MEGASONICS GEN. (Option).......................................................... 9–55
Change Meg Event TIME ................................................................................ 9–56
Change SPINDLE SPEED (During Meg)........................................................ 9–56
Change MEGASONIC SWEEP....................................................................... 9–57
VIEW PROCESS RECIPE .......................................................................................... 9–58
RECIPE TRANSFER PROCEDURE (COPY DISK) ................................................. 9–67
DEFINE DEFAULT PROCESS .................................................................................. 9–70
INTRODUCTION ........................................................................................................ 10–1
ALARM TYPES .......................................................................................................... 10–2
ALARMS ON THE SCREEN ..................................................................................... 10–3
)....................................................................... 10–5
............................................................................................ 10–7
...................................................................................... 10–8
Summary of Contents for Synergy Integra
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