ONTRAK Synergy Integra, Operation Manual

Page: 204 / 350

9-44 INTEGRA Operations Revision A 7/26/00
20-0200-231 (CR), 20-0200-232 (Std), 20-0200-251 (CD)
.
Wafer EFFECT (Brush Conditioning)
The third set of buttons (see illustration on following page) are
specifically designed to prepare (chemically dose) the brushes in both
Brush Stations either:
1)
before
processing the first wafer
after
having sat idle (1
st
WAFER)
or
2) before processing all (every) wafer (ALL WAFERS).
During continuous wafer cycling, the brush pH stays constant when
HPD PORs are used. Use the 1
st
WAFER wafer dosing options to
correct the process pH when continuous wafer cycling is interrupted.
When wafer cycling is interrupted and DI LOW FLOW is ON, then the
brush pH levels are neutralized. When normal processing resumes,
the 1
st
WAFER “effect” option doses the brushes to re-establish brush
pH, thus ensuring wafer-to-wafer process uniformity.
Select the DOSE MODE for Brush Station #1 and Brush Station #2 to
select either the 1
st
WAFER or ALL WAFERS mode of operation.
The DOSE MODE is a toggle that displays the current mode on the
DOSE MODE button. 1
st
WAFER mode will only dose the brushes
with chemical before processing the first wafer. ALL WAFERS mode
doses the brushes with chemical before processing for every wafer,
not just the first.
STANDARD