4-10
INTEGRA Operations Revision A
7/26/00
20-0200-231 (CR), 20-0200-232 (Std), 20-0200-251 (CD)
*Options: NH
4
OH Application
The HF configuration is standard for Brush Station #2 in the Integra
system. Brush Station #2 can also be configured for 2% NH
4
OH drip,
2% NH
4
OH through the brush (TTB), or 29% NH
4
OH through the
brush (TTB) mix solutions by changing and replumbing the chemical
dispense drawer(s). (See “Wafer Cleaning” on page 4-3 for more
information on NH
4
OH cleaning.)
E
DGE
C
LEAN
(
OPTION
)
Integra’s roller function is to rotate the wafer so that its axis of rotation
is centered between the two brushes. In addition, Integra’s rollers can
be configured for edge cleaning. Edge cleaning rollers contain a
cleaning pad and turn at a higher speed than the polyurethane drive
roller. This action causes the wafer edge to be scrubbed. Jets of DI water
spray the edge of the wafer and rollers to keep them wet and free of
slurry buildup. Edge clean EVENT ON/OFF times are set in the
Process Recipe screens.
C
LEAN
C
YCLE
T
IMING
When the time set in the Process Recipe for Brush Station #2 wash cycle
completes, the computer checks to see if there is a wafer in the Spin
Station. If there is a wafer in the Spin Station, the wafer in Brush Station
#2 continues to undergo a DI water cleaning process until the Spin
Station is clear. If a wafer is not detected, the wafer in Brush Station #2
transfers to the Spin Station. The time setting procedure is identical for
both Brush Stations. (See “Change EVENT TIME” on page 9-8.)
F
LAT
F
INDER
(
OPTION
)
The optional flat finder is used on Integra systems that process 6 inch
(150 mm) and 8 inch (200 mm) wafers with flats. The flat finder is
only installed in Brush Station #2 and is used to orient the position of
wafers with flats before it is transferred to the Spin Station. Wafers
with flats must be oriented so that the Spin Station fingers can
properly hold the wafer.
W
AFER
T
RANSFER
O
UT
(
WITH
F
LAT
F
INDER
)
For wafers with flats, when the transfer to the Spin Station is ready to
begin, the rollers slow (programmed in Process Recipe) the wafer’s
rotation and the FLAT FINDER sensor locates the flat. When the
sensor detects the flat, the wafer rotation stops the wafer with the flat
facing the Brush Station #2 exit. For more information on the Flat
Finder, see “Change FLAT FINDER” on page 9-22 and “Flat Finder
(option)” on page 3-17.
When the Spin Station is empty, the top brush lifts off of the wafer in
Brush Station #2, the rollers retract, and the conveyor activates to
transport the wafer into the Spin Station.
As the wafer transfers out of Brush Station #2, a manifold located at
the exit sprays DI water (top and bottom) to rinse the wafer.
Summary of Contents for Synergy Integra
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