ONTRAK Synergy Integra, Operation Manual

Page: 91 / 350

C h a p t e r 4 P R O C E S S D E S C R I P T I O N
7/26/00 INTEGRA Operations Revision A 4-13
20-0200-231 (CR), 20-0200-232 (Std), 20-0200-251 (CD)
W
AFER
T
O
S
PINDLE
T
RANSFER
When the wafer transfers, the spindle is at the MID position and the
spin fingers are open. When the wafer is in place above the spindle,
the four fingers close on the wafer two times (2x). The first time
centers the wafer between the spindle fingers. The second time
secures the wafer in the fingers. The spindle fingers are positioned so
that when they close, the fingers cause the wafer to shift upward,
lifting the wafer slightly off the conveyor. The conveyor then retracts,
out from under the wafer.
The FINGERS CLOSED sensor monitors the spindle fingers to signal
if the fingers have closed on the wafer
or have closed “too far.” If the
spindle fingers closed “too far,” the FINGERS CLOSED sensor
signals an alarm, indicating a lost or broken wafer condition.
S
PIN
P
ROCESS
Once the conveyor retracts, the spindle moves down, lowering the
wafer to the BOTTOM position in the catch cup. The spindle lock
retracts from the spindle shaft, the spin cycle starts, and the wafer
begins to spin. As the wafer spins, a final DI water rinse sprays on
the top and bottom of the wafer. The final rinse stops and the wafer
continues to spin to remove residual particulate matter from the
surfaces and to dry the wafer.
M
EGASONIC
S
WEEP
For each of the nine Spin Station EVENTS the megasonic arm can be
programed to moves across the wafer, going from the wafer edge to
the wafer center according to the speed and number of repetitions
identified in the Process Recipe. During the sweep, the megasonic
waves project through the DI water stream which flows from the
megasonic head. Megasonic waves loosen imbedded contamination
and immediately rinse it away. The megasonic sweep may be
periodically repeated as specified in the individual EVENT settings of
the Process Recipe. For more information on Spin Station options and
timing of EVENTS, see “Modify Spin Events” on page 9-51.
H
ALOGEN
(H
EAT
) L
AMP
To assist in the drying process a 1000 watt halogen lamp in the Spin
Station cover activates periodically in increments of time (seconds)
which are programmed in the EVENT settings in the Process Recipe.
For more information on Spin Station options and timing of
EVENTS, see “Modify Spin Events” on page 9-51.