C h a p t e r 3 S Y S T E M C O N F I G U R AT I O N
7/26/00
INTEGRA Operations Revision A
3-9
20-0200-231 (CR), 20-0200-232 (Std), 20-0200-251 (CD)
Optional edge cleaning rollers have preprogrammed positions
which accommodate 6 and 8 inch wafers. To set the roller position
for the desired wafer size, use the
SELECT DIAMETER
screen from
the
UTILITY MENU
screen. Choose 150 mm for 6 inch wafers and 200
mm for 8 inch wafers. In addition to the software changes, hardware
changes must also be made to change to a new wafer size.
See the
SENSOR
section below for related sensor activity.
P
ROCESS
S
OLUTION
D
RIP
: NH
4
OH (P
RIMARY
S
YSTEM
U
SE
)
The process solution (ammonium hydroxide) flows to the Brush
Station, and is controlled by a flow regulator. A process solution drip
line deposits cleaning solution onto the brushes, to improve the
wafer cleaning process.
Z
DANGER! CHEMICAL HAZARD:
Operators and technicians must become
familiar with the potential hazards associated with the chemicals used in the system. A
Materials Safety Data Sheet (MSDS) for the chemicals used should be present near the
area of use.
P
ROCESS
S
OLUTION
I
NJECTION
: HF (O
PTIONAL
C
ONFIGURATION
)
Brush Station #1 brushes are plumbed to allow the conversion of the
system for the injection of dilute hydrofluoric acid through the
brushes. This conversion requires changing the chemical dispense
drawer. Once the mechanical changes and hookups have been
accomplished, the process control key must be reset to HF1. This
resets the processing and reconfigures the Brush Station #1 Process
Recipe screen to include the HF dispense option. In this system
configuration, the dilute HF can be injected through the permeable
brush membrane onto the wafer surfaces, to etch away a small
amount of the film deposited on the wafer. The amount of time that
the HF is flowing through the brushes is set in the Process Recipe
screen for Brush Station #1.
Z
DANGER! CHEMICAL HAZARD:
Operators and technicians must become
familiar with the potential hazards associated with the chemicals used in the system. A
Materials Safety Data Sheet (MSDS) for the chemicals used should be present near the
area of use.
E
XIT
S
PRAY
(R
INSE
)
A spray manifold located above and across the wafer exit path in
Brush Station #1, sprays DI water on the exiting wafer to rinse off
loosened contaminants. A spray shield protects against overspray.
Summary of Contents for Synergy Integra
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