C h a p t e r 9 P R O C E S S R E C I P E
7/26/00
INTEGRA Operations Revision A
9-19
20-0200-231 (CR), 20-0200-232 (Std), 20-0200-251 (CD)
17 ALARM BRUSH MODE, PROCESS ALARM TIMEOUT, and
FLUSH DURATION, work together. Touch ALARM BRUSH
MODE to set the position of the brushes on the wafer (UP or
DOWN) once Alarm #158 signals.
Select DOWN (default) to leave the brushes on the wafer. When
DOWN is selected, the brushes and rollers continue to turn.
Select UP to lift the brushes off the wafer. When UP is selected,
the brushes and rollers stop turning.
A
NOTE:
Time out Alarms #158 and #159 are used to prevent wafers from being over
exposed to the process chemical in an EVENT, usually caused by a delay “downstream”
of the Brush Station. Alarms #158 and #159 will not signal when the system is in STOP
mode. Always clear wafers from the Brush Stations prior to stopping the system to
ensure wafer to wafer uniformity.
Change BRUSH IDLE SPEED
18 Touch BRUSH IDLE SPEED to display the
NUMBER PAD
to set
the idle speed.
19 Enter the desired BRUSH IDLE SPEED
(
RPM
) on the
NUMBER
PAD
(not shown), and touch ENTER.
STANDARD
Summary of Contents for Synergy Integra
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