ONTRAK Synergy Integra, Operation Manual

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C h a p t e r 9 P R O C E S S R E C I P E
7/26/00 INTEGRA Operations Revision A 9-63
20-0200-231 (CR), 20-0200-232 (Std), 20-0200-251 (CD)
SUMMARY OF SYSTEM RANGES
Parameter Range Units
Brush #1 and #2 Stations
Entrance Spray (Brush #1 only) On/Off Binary (1 or 0)
Process Chemistry On/Off Binary (1 or 0)
Brush Height >0, <50
(5 mm max)
10
th
of mm
Event Time 0 - 1800 (3 min)
(0-180 seconds)
10
th
of seconds
Roller Speed 30 - 140*/190/450 rpm
Brush Speed 30 - 140*/190/450 rpm
Drip Time 0 - 1800 (3 min)
(0-180 seconds)
10
th
of seconds
Drip Wafer Count 0 - 500 each
Brush Idle Timer
(Brush Clean Start)
0 - 864000 (24 hrs)
10
th
of seconds
Idle Clean ON Time 0 - 36000 (1 hour)
10
th
of seconds
Idle Clean OFF Time 0 - 864000 (24 hrs)
10
th
of seconds
Edge Clean, Clean ON time 0 - 36000 (1 hour)
10
th
of seconds
Edge Clean, Clean OFF time 0 - 864000 (24 hrs)
10
th
of seconds
Brush Idle Speed 0 - 140*/190/450 rpm
Wafer Idle Time 0 - 864000 (24 hrs)
10
th
of seconds
Wafer Dose Time 0 - 36000 (1 hour)
10
th
of seconds
Flat Finder Speed (Brush #2 only)
(standard motor)
10 - 140*/190/450 rpm
Exit Spray (Brush #1 only) On/Off Binary (1 or 0)
Inside Brush Exit Spray (Brush #2) On/Off Binary (1 or 0)
Spin Station (Events 1-9)
Upper Rinse On/Off Binary (0 or 1)
Lower Rinse On/Off Binary (0 or 1)
Heat Lamp On/Off Binary (0 or 1)
Megasonic Generator On/Off Binary (0 or 1)
Time 0-1800
(3 min max)
10
th
of seconds
Spindle Speed
(Never run above 1800 rpm with
wafer present except during
spindle control calibration.)
0, or 30-2500 rpm
Megasonic Sweeps 0-25 sweeps
Seconds/Sweep 0, or 5-15 seconds/sweep