ONTRAK Synergy Integra, Operation Manual

Page: 205 / 350

C h a p t e r 9 P R O C E S S R E C I P E
7/26/00 INTEGRA Operations Revision A 9-45
20-0200-231 (CR), 20-0200-232 (Std), 20-0200-251 (CD)
Except for systems configured with DI Low Flow air controll valves,
DI water flows through the continuously turning brushes. During the
Wafer (Effect) Brush Conditioning process, the brushes in both stations
are flooded (either through the brushes or onto the brushes) with
process chemical to correctly balance the chemical saturation
and pH
for a set period of time before a wafer is allowed to enter the station.
The Wafer Dose Brush Conditioning process is activated after the
Brush Stations have been idle for the time set in the WAFER IDLE
TIME variable. Once the wafer process activates, the system waits
for a signal that a wafer is ready to begin processing. When the
selected flow conditions are enabled for the time set by the Wafer
Dose Time variables (BB #1 & BB #2), then the correct pH level is set
for processing.
Once all Wafer (Effect) Brush Conditioning process settings are
complete, the system will determine when to start each dosing
procedure so that the brushes will be at the proper pH level when
the wafer arrives at the station.
A
NOTE:
If First Wafer Dose is enabled and a process timeout alarm(s) occurs (Alarm
#158 and/or #159), then the cleaner will be put into CLEARING mode. After the alarm
timeout period, the First Wafer Dose for the next wafer may occur BEFORE the cleaner
comes out of the CLEARING mode.
STANDARD