ONTRAK Synergy Integra, Operation Manual, Page: 21 / 350

C H A P T E R 1
7/26/00 INTEGRA Operations Revision A 1-1
20-0200-231 (CR), 20-0200-232 (Std), 20-0200-251 (CD)
I N T R O D U C T I O N
INTEGRA SYSTEM INTEGRATION
1
The Synergy Integra™ is a cluster tool that integrates with a chemical
mechanical polishing (CMP) unit and clean room. The Integra uses
proven Synergy cleaning technologies. The Integra system is designed
to clean wafers using options for a variety of chemical processes
which operate in conjunction with the mechanical processes. Integra
is a continuous feed system that does not process individual cassettes
of wafers. The Integra can clean 150 mm and 200 mm wafers
(standard). The cleaner is composed of four stations and an Electrical
Enclosure which operate together to meet manufacturers’ process
requirements. A GEM interface is used to communicate with the
integrated polisher. The following options are detailed in this manual,
although not all options are installed on every Integra.
Software Version
The Integra cleaner’s base system software level is 2.2.3, and screens
presented in this manual reflect the 2.2.3 software. Integras shipped
after the manual’s release date may have higher software revision
levels.
System Options
Options:
•
Remote Electrical Enclosure
•
Megasonic Cleaning Unit
•
ULPA Filter Unit
•
Edge Cleaning (both Brush Boxes)
•
Chemical Distribution Drawers (Interchangeable - 2% NH
4
OH Drip
[standard], 29% NH
4
OH Through-the-Brush, Through-the-Brush,
0.5% HF/HF, etc.)
•
Through-the-back (TTB) Facilities Hookup
•
End load Input Station
•
Through-the-end (TTE) Facilities Hookup
•
Back load Input Station
Input Station
The delivery of a single wafer from a CMP system by an Input Robot
into the Input Station starts the cleaning cycle. The wafer is received
from the Input Robot, rinsed and transported into Brush Station #1.
Brush Station #1
Brush Station #1 is the first Brush Station the wafer enters in the
processing cycle. The first wafer cleaning process is performed in
Brush Station #1.
Brush Station #2
Brush Station #2 is the second Brush Station the wafer enters in the
processing cycle. The second wafer cleaning process is performed in
Brush Station #2.