3-8
INTEGRA Operations Revision A
7/26/00
20-0200-231 (CR), 20-0200-232 (Std), 20-0200-251 (CD)
BRUSH STATION #1
E
NTRANCE
S
PRAY
Brush Station #1 is the first of two cleaning stations contained in the
brush box. A preliminary rinse of the wafer is required before the
brushes contact the wafer. DI water is sprayed from a manifold, just
before the wafer enters Brush Station #1.
B
RUSHES
Brush Station #1 contains two brushes. The top brush is located
directly over the bottom brush. The brushes, rotating in opposite
directions, simultaneously cleaning both sides of the wafer. The top
brush is mounted on a swing arm which rises to allow the wafers to
enter and exit the Brush Station. The arm is moved by a stepper
motor. During the cleaning cycle, the top brush (arm) lowers to
contact the wafer surface.
Brushes are made of a proprietary material which allows them to
“port” or pass DI water evenly from the core of the brush to the
external surface of the brush. A continuous flow of DI water is
required to ensure wafer surfaces are properly cleaned and rinsed.
B
CAUTION!:
Brushes should never be allowed to dry out.
Keep DI water running
through the brushes at all times or remove them and store in DI water (containing a
small amount of ammonium hydroxide, if possible) until they are reinstalled.
R
OLLERS
AND
E
DGE
C
LEAN
(
OPTION
)
As the wafer enters Brush Station #1, a set of rollers intercept the
wafer and hold it in a horizontal position, centered between the two
brushes. This prevents the wafer from contact with the conveyor
during the cleaning process. There is a special (optional) cleaning
pad installed on the wafer contact surface of the roller. This pad
helps clean the edge of the wafer as it turns the wafer between the
brushes. Rollers turn at difference speeds to enhance the cleaning
ability of the pads on the roller. The drive rollers turn at the speed set
in the process program (recipe), in the
BRUSH STATION PROCESS
PROGRAM
screen, under ROLLER SPEED.
In addition to the roller pads, there are spray nozzles (top and
bottom) directed at the wafer edges near the rollers. These rinse the
particulate and other contaminants loosened by the rollers.
Summary of Contents for Synergy Integra
Page 8: ......
Page 24: ...1 4 INTEGRA Operations Revision A 7 26 00 20 0200 231 CR 20 0200 232 Std 20 0200 251 CD...
Page 38: ...2 14 INTEGRA Operations Revision A 7 26 00 20 0200 231 CR 20 0200 232 Std 20 0200 251 CD...
Page 222: ...9 62 INTEGRA Operations Revision A 7 26 00 20 0200 231 CR 20 0200 232 Std 20 0200 251 CD...
Page 314: ...10 76 INTEGRA Operations Revision A 7 26 00 20 0200 231 CR 20 0200 232 Std 20 0200 251 CD...