C h a p t e r 9 P R O C E S S R E C I P E
7/26/00
INTEGRA Operations Revision A
9-29
20-0200-231 (CR), 20-0200-232 (Std), 20-0200-251 (CD)
Drip Wafer Count Brush Cleaning
Use the
Drip Wafer Count
variables to set the number of wafers which
pass through the Brush Station between brush cleaning cycles
during normal processing. This option is only used when DI water,
(not chemical) is used to process each wafer. Periodically (based on
wafer count) a process chemical, usually NH
4
OH, is introduced to
clean the brushes.
When the number of processing wafers in the
DRIP WAFER
COUNT
variable is reached, the system “pauses” to prevent a wafer from
entering the Brush Station after the previous wafer exits. When the
Brush Station is empty, a brush cleaning is performed for the period
of time set in the
DRIP TIME
variable.
The brush cleaning cycle is dependent on the presence of NH
4
OH in the
Brush Station configurations. If the Brush Station is set up to process
with NH
4
OH, then NH
4
OH will either flow onto or through the top
and/or bottom brush(s), depending on the station’s configuration of the
chemical distribution drawer (
a.k.a.
chemical drawers).
The ten (10) Drip Wafer Count Brush Cleaning buttons (see following
figure) are only functional when the manual HF Key Switch is active.
When active, NH
4
OH is dispensed in the STD and HF1 key positions.
The HF2 position is not functional. When hi toxic or lo toxic chemicals
are configured in the Brush Stations, the drip manifolds is/are not
used. In hi toxic and low toxic mode the Drip buttons may not display,
however if the buttons are displayed, they are not functional.
DOSE LOW FLOW DI:
Toggle ON/OFF (default: ON).
Sets the DOSE LOW FLOW DI
OFF in the Process Recipe for a
specific Brush Station.
When DOSE LOW FLOW DI is set to
ON, DI water (from DOSE LOW
FLOW DI) is used to dose the
brushes. Brush dosing continues for
the time set in the WAFER DOSE
TIME.
When DOSE MODE is selected,
and/or the DOSE LOW FLOW
DI, and/or the DOSE HI
FLOW DI are set to ON, then
all selected functions start when
the dosing chemical starts.
DOSE HI FLOW DI:
Toggle ON/OFF (default:
OFF). Sets the DOSE HI
FLOW DI ON in the Process
Recipe for a specific Brush
Station.
When DOSE LOW FLOW DI is set to
ON, DI water (from DOSE HI FLOW
DI) is used to dose the brushes.
Brush dosing continues for the
time set in the WAFER DOSE
TIME.
When DOSE MODE is selected,
and/or the DOSE LOW FLOW
DI, and/or the DOSE HI
FLOW DI are set to ON, then
all selected functions start
when the dosing starts.
Note 1: All times on the
BRUSH STATION CLEANING DEFINE SCREEN
are displayed in seconds, HOWEVER,
all times are entered in the
NUMBER PAD
screen in
10
t
h
of seconds
. For example, if the desired event time is
3.2 seconds, it is entered as 32. No decimal point is used!
BUTTON NAME & TYPE
DESCRIPTION
COMMENTS
Summary of Contents for Synergy Integra
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