ONTRAK Synergy Integra, Operation Manual

Page: 191 / 350

C h a p t e r 9 P R O C E S S R E C I P E
7/26/00 INTEGRA Operations Revision A 9-31
20-0200-231 (CR), 20-0200-232 (Std), 20-0200-251 (CD)
A
NOTE:
If the Brush Station is set up to process chemical, then chemical will be
dispensed to the brush, even if the DRIP CHEM button (operational during the
coinciding
EVENT
) is toggled to the OFF position.
Change DRIP WAFER COUNT
6 Touch DRIP WAFER COUNT for Brush Station #1 Cleaning to
display the
NUMBER PAD
and set the number of wafers between
brush cleaning cycles. This option is only used when DI water,
(not chemical) is used to process each wafer. Periodically (based
on wafer count) NH
4
OH is introduced to clean the brushes.
7 Enter the desired count on the
NUMBER PAD
(not shown), and
touch ENTER.
Use the DRIP WAFER COUNT button to set the number of wafers
that can pass through the Brush Station without interruption. When
the number is reached, processing is halted, no incoming wafers are
allowed into the Brush Station(s), and the brushes are cleaned.
If Brush Station #2 is processing with NH
4
OH, then the process is
identical to Brush Station #1 processing with NH
4
OH.
8 Touch DRIP WAFER COUNT for Brush Station #2 Cleaning to
display the
NUMBER PAD
to set the number of wafers between
brush cleaning cycles.
9 Enter the desired count on the
NUMBER PAD
(not shown), and
touch ENTER.
STANDARD