C h a p t e r 9 P R O C E S S R E C I P E
7/26/00
INTEGRA Operations Revision A
9-35
20-0200-231 (CR), 20-0200-232 (Std), 20-0200-251 (CD)
Change Idle Time Brush Cleaning Interval
Use the second set of three buttons to set the timers used in the
brush(s) cleaning process during an extended system idle time.
Brush idle time is defined as (1) no wafers present to clean, and
(2) the START button active (ON).
When the system becomes idle with no wafers to process, a timer
(
10
th
of seconds
) begins to count until it matches the time set in the
BRUSH IDLE TIMER variable.
When the timer matches the time, process chemical and/or DI Low
Flow and/or DI High Flow are dispensed to the brushes (through
the brush or drip) for the period of time set (
10
th
of seconds
) in the
CLEAN ON TIME
variable.
At the end of the CLEAN ON TIME, the
CLEAN OFF TIME
turns
off the flow for the length of time set (
10
th
of seconds
) in the
CLEAN OFF TIME
variable.
At the end of the CLEAN OFF TIME, the CLEAN ON TIME again
cycles ON. This brush cleaning cycle continues until normal
wafer processing resumes.
STANDARD
Summary of Contents for Synergy Integra
Page 8: ......
Page 24: ...1 4 INTEGRA Operations Revision A 7 26 00 20 0200 231 CR 20 0200 232 Std 20 0200 251 CD...
Page 38: ...2 14 INTEGRA Operations Revision A 7 26 00 20 0200 231 CR 20 0200 232 Std 20 0200 251 CD...
Page 222: ...9 62 INTEGRA Operations Revision A 7 26 00 20 0200 231 CR 20 0200 232 Std 20 0200 251 CD...
Page 314: ...10 76 INTEGRA Operations Revision A 7 26 00 20 0200 231 CR 20 0200 232 Std 20 0200 251 CD...