Rev. 3.00 Jan 25, 2006 page iii of lii
General Precautions on Handling of Product
1. Treatment of NC Pins
Note: Do not connect anything to the NC pins.
The NC (not connected) pins are either not connected to any of the internal circuitry or are
used as test pins or to reduce noise. If something is connected to the NC pins, the
operation of the LSI is not guaranteed.
2. Treatment of Unused Input Pins
Note: Fix all unused input pins to high or low level.
Generally, the input pins of CMOS products are high-impedance input pins. If unused pins
are in their open states, intermediate levels are induced by noise in the vicinity, a pass-
through current flows internally, and a malfunction may occur.
3. Processing before Initialization
Note: When power is first supplied, the product’s state is undefined.
The states of internal circuits are undefined until full power is supplied throughout the
chip and a low level is input on the reset pin. During the period where the states are
undefined, the register settings and the output state of each pin are also undefined. Design
your system so that it does not malfunction because of processing while it is in this
undefined state. For those products which have a reset function, reset the LSI immediately
after the power supply has been turned on.
4. Prohibition of Access to Undefined or Reserved Addresses
Note: Access to undefined or reserved addresses is prohibited.
The undefined or reserved addresses may be used to expand functions, or test registers
may have been be allocated to these addresses. Do not access these registers; the system’s
operation is not guaranteed if they are accessed.
Summary of Contents for H8S/2158
Page 10: ...Rev 3 00 Jan 25 2006 page viii of lii...
Page 36: ...Rev 3 00 Jan 25 2006 page xxxiv of lii B Product Lineup 863 C Package Dimensions 864 Index 865...
Page 47: ...Rev 3 00 Jan 25 2006 page xlv of lii Appendix Figure C 1 Package Dimensions TBP 112A 864...
Page 54: ...Rev 3 00 Jan 25 2006 page lii of lii...
Page 70: ...Section 1 Overview Rev 3 00 Jan 25 2006 page 16 of 872 REJ09B0286 0300...
Page 118: ...Section 3 MCU Operating Modes Rev 3 00 Jan 25 2006 page 64 of 872 REJ09B0286 0300...
Page 126: ...Section 4 Exception Handling Rev 3 00 Jan 25 2006 page 72 of 872 REJ09B0286 0300...
Page 198: ...Section 6 Bus Controller Rev 3 00 Jan 25 2006 page 144 of 872 REJ09B0286 0300...
Page 326: ...Section 10 8 Bit PWM Timer PWM Rev 3 00 Jan 25 2006 page 272 of 872 REJ09B0286 0300...
Page 440: ...Section 15 Watchdog Timer WDT Rev 3 00 Jan 25 2006 page 386 of 872 REJ09B0286 0300...
Page 606: ...Section 17 I 2 C Bus Interface IIC Rev 3 00 Jan 25 2006 page 552 of 872 REJ09B0286 0300...
Page 742: ...Section 19 Multimedia Card Interface MCIF Rev 3 00 Jan 25 2006 page 688 of 872 REJ09B0286 0300...
Page 750: ...Section 21 D A Converter Rev 3 00 Jan 25 2006 page 696 of 872 REJ09B0286 0300...
Page 768: ...Section 22 A D Converter Rev 3 00 Jan 25 2006 page 714 of 872 REJ09B0286 0300...
Page 770: ...Section 23 RAM Rev 3 00 Jan 25 2006 page 716 of 872 REJ09B0286 0300...
Page 824: ...Section 26 Clock Pulse Generator Rev 3 00 Jan 25 2006 page 770 of 872 REJ09B0286 0300...
Page 844: ...Section 27 Power Down Modes Rev 3 00 Jan 25 2006 page 790 of 872 REJ09B0286 0300...
Page 878: ...Section 28 List of Registers Rev 3 00 Jan 25 2006 page 824 of 872 REJ09B0286 0300...
Page 926: ...Index Rev 3 00 Jan 25 2006 page 872 of 872 REJ09B0286 0300...