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Appendix A MCU Electrical Specifications
MC9S12ZVM Family Reference Manual Rev. 1.3
750
Freescale Semiconductor
4. Thermal resistance between the die and the printed circuit board per JEDEC JESD51-8. Board temperature is measured on
the top surface of the board near the package.
5. Thermal resistance between the die and the case top surface as measured by the cold plate method (MIL SPEC-883 Method
1012.1).
6. Thermal resistance between the die and the solder pad on the bottom of the package based on simulation without any interface
resistance
7. Thermal characterization parameter indicating the temperature difference between package top and the junction temperature
per JEDEC JESD51-2