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Chapter 1 Device Overview MC9S12ZVM-Family
MC9S12ZVM Family Reference Manual Rev. 1.3
Freescale Semiconductor
19
specification changes. Please refer to the Mask Set Errata documents for details.
•
Device Level
— Changed BDC fast clock source from core clock to bus clock
— Added exposed pad electrical connection to die VSS.
— Device level current injection immunity improved
— GDU register address range changed
— Removed mapping of VRL to PAD7
— Added ADC reference voltages to IFR
— Increased over voltage detect thresholds to allow operating range up to 26.5V
•
GDU
— Added status flags for overvoltage on HD pin and low voltage on VLS
— Blanking time: start internal blanking time generator with HGx/LGx instead of PWM signal
— Added over current shutdown feature
— Added low pass filter to desaturation comparators
•
SCI V6 replaces V5
— Enhanced baud rate options
•
LINPHY
— Direct Power Injection (DPI) robustness improvements
— TX dominant timeout feature
— Internal pull-up adjusted to stay in 27KOhm to 40KOhm range
•
OSC, CPMU:
— Added full swing Pierce mode
— Added a configuration bit OMRE (Oscillator Monitor Reset Enable) that will enable the
Monitor Reset. By default, clock monitor reset disabled (OMRE=0).
•
PTU:
— Allow swapping the trigger list at every reload event with load_ok active
— Made the TG0LIST and TG1LIST writable if the associated TG0/TG1 is disabled
— Allow SW to clear the PTULDOK bit when the PTU is disabled
•
FTMRZ:
— Added wait state configuration option bits for bus accesses
— Removed interdependency of DFDF and SFDIF bits
— Changed FTMRZ behavior when forbidden simultaneous P-flash/D-flash operations occur
•
DBG:
— Added register access restrictions when DBG is disarmed but a profiling transmission is still
active
— Added a register bit to indicate that the profiling transmission is still active
•
BDC
— Improved handling of attempted internal accesses during STOP mode