Appendix A MCU Electrical Specifications
MC9S12ZVM Family Reference Manual Rev. 1.3
Freescale Semiconductor
749
Figure A-2. Supply Currents Overview
Table A-8. Thermal Package CharacteristicsI/O Characteristics
Num
C
(1)
1. The values for thermal resistance are achieved by package simulations
Rating
Symbol
Min
Typ
Max
Unit
64LQFP-EP
8
D
Thermal resistance 64LQFP-EP, single sided PCB
(2)
Natural Convection
2. Junction to ambient thermal resistance,
θ
JA
was simulated to be equivalent to JEDEC JESD51-2 with the single layer board
(JESD51-3) horizontal.
θ
JA
—
64
—
°
C/W
9
D
Thermal resistance 64LQFP-EP, double sided PCB
with 2 internal planes. Natural Convection.
θ
JA
—
30
—
°
C/W
10
D
Thermal resistance 64LQFP-EP, single sided PCB
(@200 ft./min)
θ
JA
—
51
—
°
C/W
11
D
Thermal resistance 64LQFP-EP, double sided PCB
(3)
with 2 internal planes (@200 ft./min).
3. Junction to ambient thermal resistance,
θ
JA
was simulated to be equivalent to the JEDEC specification JESD51-6 with the
board (JESD51-7) horizontal.
θ
JA
—
24
—
°
C/W
12
D
Junction to Board 64LQFP-EP
(4)
θ
JB
—
13
—
°
C/W
13
D
Junction to Case Top 64LQFP-EP
(5)
θ
JCtop
—
16
—
°
C/W
14
D
Junction to Case Bottom 64LQFP-EP
(6)
θ
JCbottom
—
1.6
—
°
C/W
15
D
Junction to Package Top 64LQFP-EP
(7)
Ψ
JT
—
4
—
°
C/W
VSUP
VCP
VBS[2:0]
VDDA
VDDX1
VDDX2
VSSX1
LIN
EVDD1
VBAT
I
SUP
I
EVDD
I
LIN
GND
GPIO
I
I/O
V
I/O
V
DDX
R
L1
R
L2
MC9S12ZVM-Family
L Package Option
BCTL
VLS_OUT
I
RBATP
I
VDDX
VLS[2:0]