MSC8144E Reference Manual, Rev. 3
11-22
Freescale
Semiconductor
Internal Memory Subsystem
•
Select write by writing a 1 to the WR field in bit 23.
•
Initiate the access by writing a 1 to the INIT field in bit 24.
3.
Data in bytes not selected by the byte enable field are discarded (write is not performed).
4.
After the access is complete, hardware clears the L2IC_DBG_ACS[INIT] bit to enable a
new access.
11.5
M2 Memory
Figure 11-4 shows the M2 memory architecture. The 512 KB memory performs 128-bit wide
accesses at 400 MHz and is accessible to any of the DSP core subsystems or any other initiator in
the system (L2 ICache, DMA controller, TDM, QUICC Engine module subsystem, serial
RapidIO subsystem, PCI). The memory is partitioned into four 128 KB memory groups to allow
four simultaneous accesses. The group addresses are interleaved with 256-byte interleave
resolution which is optimized to minimize contentions between accesses. The M2 memory uses
SRAM technology and supports both single and burst accesses with a single wait state. The M2
memory is fully ECC protected. The M2 memory supports partial accesses. Automatic
read-modify-write accesses are generated to maintain ECC protection. The M2 memory is
volatile after reset.
The 512 KB M2 memory contains four interleaved banks of 128 KB each, operating at the
system frequency supporting 128 bits data bus width. The M2 is a unified memory that stores
both data and program code. All of the DSP cores, as well as the DMA, PCI, TDM, RapidIO, L2
ICache, and the QUICC Engine subsystem, can access the M2 memory through the systems
interconnect. The four M2 banks can be accessed simultaneously by four different initiators to
accommodate the four cores. The interleaving feature improves the total system performance by
reducing the probability of transaction collisions. The bank interleaving resolution is 256 bytes
which is optimal for the DSP cores.
To reduce possible impact of soft error rate (SER) on systems using the MSC8144E, the M2
employs error correction code (ECC). The ECC being deployed adds 7 bits of ECC on each 64
Figure 11-4. M2 Memory Architecture
M2 0
128KB
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0
M2 1
128KB
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1
M2 2
128KB
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2
M2 3
128KB
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Содержание MSC8144E
Страница 1: ...MSC8144E Reference Manual Quad Core Media Signal Processor MSC8144ERM Rev 3 July 2009 ...
Страница 40: ...MSC8144E Reference Manual Rev 3 xl Freescale Semiconductor Contents 26 5 12 8 RNG Output FIFO 26 186 ...
Страница 48: ...MSC8144E Reference Manual Rev 3 xlviii Freescale Semiconductor ...
Страница 86: ...MSC8144E Reference Manual Rev 3 1 38 Freescale Semiconductor Overview ...
Страница 167: ...OCE Event and JTAG Test Access Port Signals MSC8144E Reference Manual Rev 3 Freescale Semiconductor 3 59 ...
Страница 168: ...MSC8144E Reference Manual Rev 3 3 60 Freescale Semiconductor External Signals ...
Страница 242: ...MSC8144E Reference Manual Rev 3 5 26 Freescale Semiconductor Reset ...
Страница 314: ...MSC8144E Reference Manual Rev 3 8 24 Freescale Semiconductor General Configuration Registers ...
Страница 414: ...MSC8144E Reference Manual Rev 3 10 14 Freescale Semiconductor MSC8144E SC3400 DSP Subsystem ...
Страница 452: ...MSC8144E Reference Manual Rev 3 11 38 Freescale Semiconductor Internal Memory Subsystem ...
Страница 520: ...MSC8144E Reference Manual Rev 3 12 68 Freescale Semiconductor DDR SDRAM Memory Controller ...
Страница 884: ...MSC8144E Reference Manual Rev 3 17 44 Freescale Semiconductor RapidIO Interface Dedicated DMA Controller ...
Страница 1070: ...MSC8144E Reference Manual Rev 3 21 28 Freescale Semiconductor Timers ...