Table 1. Revision History (continued)
Description
Revision
Date
–
Corrected figure ADC Input Equivalency.
–
Removed Dither Enable bit and corrected reset for
ADCCTL
register.
■
In the UART chapter, clarified that for a receive timeout, the
RTIM
bit in the
UARTIM
register must
be set to see the
RTMIS
and
RTRIS
status in the
UARTMIS
and
UARTRIS
registers.
■
In the SSI chapter:
Clarified Receive FIFO operation.
–
–
Clarified DMA operation.
–
Removed End of Transmission (
EOT
) bit 4 from
QSSI Control 1 (SSICR1)
register.
■
In the Ethernet chapter, clarified Initialization and Configuration.
■
In the USB chapter, added important note that when configured as a bus-powered Device, the USB
can operate in SUSPEND mode but produces a higher power draw than required to be compliant.
■
In the Electrical Characteristics chapter:
In Reset Characteristics table, updated internal reset time parameter values.
–
–
In PIOSC Clock Characteristics table, updated parameter values.
–
In Hibernation External Oscillator (XOSC) Input Characteristics table, removed parameter C0
Crystal shunt capacitance.
–
Updated Crystal Parameters table.
–
In Hibernation Module Tamper I/O Characteristics table, updated TMPRn pull-up resistor
parameter values.
–
In Flash Memory Characteristics table, updated T
PROG64
nom value.
–
In EEPROM Characteristics table, added values for Read access time and removed EEPROM
recovery Power-On Reset delay parameter.
–
In EPI PSRAM Interface Characteristics table, updated Min value for EPI_CLK period.
–
In ADC Electrical Characteristics at 1 Msps table, updated values for V
ADCIN
parameter.
–
Corrected ADC Input Equivalency diagram.
–
In Bi- and Quad-SSI Characteristics table, added clarifying footnotes.
–
Added PWM Timing Characteristics table.
–
Updated Current Consumption table.
–
In Peripheral Current Consumption table, updated I
DDEMAC
Nom value.
■
In Package Information appendix:
Updated Orderable Devices section to reflect silicon revision 3 part numbers.
–
–
Added Device Nomenclature section.
–
Deleted packaging materials section and put into separate document.
■
Additional minor data sheet clarifications and corrections.
15638.2711
December 2013
■
Changed NDA (Non-Disclosure Agreement) footer to indicate NDA only applies to USB content.
■
In System Control chapter:
Added sections "Optional Clock Output Signal (DIVSCLK)" and "Hardware System Service
Request".
–
–
Removed some registers and bits:
•
LDORDRIS
bit from
Raw Interrupt Status (RIS
) register,
LDORDIM
bit from
Interrupt Mask
Control (IMC)
register, and
LDORDMIS
bit from
Masked Interrupt Status and Clear (MISC)
register
•
Deep Sleep Mode Memory Timing Register 0 for Main Flash and EEPROM
(DSMEMTIM0)
register
•
LDO Power Calibration (LDOPCAL)
register
•
LDO Sleep Power Control (LDOSPCTL)
register
•
LMINERR
bit from
Sleep/Deep-Sleep Power Mode Status (SDPMST)
register
–
Added
LDOSME
,
TSPDE
,
PIOSCPDE
,
SRAMSM
,
SRAMLPM
,
FLASHLPM
, and
LDOSEQ
bits in
SYSPROP
register.
■
In Internal Memory chapter:
June 18, 2014
46
Texas Instruments-Production Data
Revision History