K465i Operations and Maintenance
P/N 1212831 Rev C
Page 4-24
Copyright
©
2012
Veeco Instruments, Inc. Confidential
All Rights Reserved
Table 4-2.
Recommended Method of Substrate Removal
1. Place the handling tool (tweezers or vacuum wand) on the
edge of the wafer flat.
Note: To prevent chipping of the SiC coating on the wafer
carrier, do not attempt to lift the wafer by laying the handling
tool on the pocket edge and prying up.
2. Lift the wafer straight up approximately ¾" (2 cm).
3. Roll the tweezers 180
o
and slide under wafer.
4. After sliding the tweezers under the wafer, close the
tweezers, grab the wafer and lift.
5. Place wafer in applicable storage container.