Lucent Technologies DDM-2000 OC-3, User & Service Manual

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363-206-285 Circuit Order:
NTP-051
Issue 2, February 2000 Page 2 of 6
DDM-2000 OC-3 M
ULTIPLEXER
DO ITEMS BELOW IN ORDER LISTED . . . . .FOR DETAILS, GO TO
Use the
rtrv-alm:
command to verify that no alarms, locks,
loops, or switches are present.
2. Notify maintenance center that alarms will be generated.
DLP-532 3. Upgrade software in each DDM-2000 OC-3/OC-12 shelf with a
release that supports OC-3/IS-3 interfaces (Ring TARP Release 7
(OC-12), Ring TARP Release 13 or later (OC-3), if not already
performed.
4. !
CAUTION:
Removal of the wrong cross-connections may cause service
interruption.
NOTE:
When signals or circuit packs are removed, alarms will be
generated until update procedures are performed.
NOTE:
STS1E slots cannot be unequipped without an alarm until all
cross-connections are removed. The cross-connections
must be removed first before removing circuit packs.
NOTE:
If the OC-3 circuit pack is going to be using the same
cross-connects as the EC-1 circuit pack that is to be
removed, then the only cross-connects that need to be
deleted are those at the node where the circuit pack is being
replaced. The pass throughs can remain.
NTP-036 At the first set of dual ring interworking nodes having circuit packs
replaced, discontinue the EC-1 interface cross-connections at the
OC-3 node [NTP-036]/OC-12 node [NTP-025]. Note that only
cross-connections at the DRI node are being discontinued
using NTP-036 or NTP-025.
5. At the first set of dual ring interworking nodes having circuit packs
replaced, remove both 3STS1E circuit packs from the OC-12
node and both STS1E circuit packs from the OC-3 node. (For
example, see Figure 1. Remove the 3STS1E circuit packs from
the OC-12 at node D and the STS1E circuit packs from the OC-3
at node G.)
DLP-532
NTP-036
NTP-025