Lucent Technologies DDM-2000 OC-3, User & Service Manual

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363-206-285
System Introduction
1-16 Issue 3 June 2001
DDM-2000 OC-3 Multiplexer
Release 13.0
1
Release Description 1
NOTE:
DDM-2000 OC-3 Release 13.0 is NOT compatible with previous releases of
DDM-2000 OC-3. Therefore, when upgrading a subnetwork, care should be
taken to avoid isolating NEs that have not yet been upgraded to Release
13.0.
The following paragraphs provides a brief description of the DDM-2000 OC-3
Multiplexer Release 13.0.
Release 13.0 is an enhanced ring release which provides all the transmission
features of previous DDM-2000 releases. In addition, Release 13.0 supports the
following applications and features:
■
New Applications:
— Enhanced FiberReach topologies. Supports enhanced routing with
the single OC-1 26G2-U OLIU. The 26G2-U, with built-in multiplexer
capabilities, can drop DS1s without the need for the MXRVO
Multiplexer or BBF5 Jumper circuit packs. The 26G2-U provides
OC-1 ring pass-through, OC-1 ring hairpin single-homed and dual-
homed, and OC-1 ring hairpin local drop applications.
— Transmultiplexer DS3 path termination. The new TMUX circuit pack
(BBG20) provides path termination functions for an M13 or C-bit
parity DS3 signal. It demultiplexes the DS3 into 28 DS1s, performs
DS1 PM, maps each DS1 into a VT1.5, and multiplexes the 28
VT1.5s into an STS-1.
— High bit rate Digital Subscriber Line (HDSL). The HDSL circuit pack
(BBF8) provides HDSL interface capability on the DDM-2000 OC-3
shelf. It allows the transport of T1 payloads, for up to 12,000 feet,
over two metallic 24 AWG twisted-pair lines.
*
— Interworking with Tellabs TITAN
†
5500/S Release 5.0 Digital
Cross-Connect System.
* The HDSL circuit pack can also be installed in DDM-2000 OC-3 shelves running linear
Releases 6.2 and later, and ring Releases 7.1 and later. Refer to information included with
each circuit pack for provisioning instructions.
†
TITAN is a trademark of Tellabs, Inc.