Strasbaugh 6DS-SP, Operation Manual

Page: 1117 / 1562

STRASBAUGH, INC.
Page 44 6DS-SP User Interface Reference May 31, 2001 (Ver 4.37)
MACHINE PARAMETERS MENU (cont.)(screen page 3):
MENU ITEM DESCRIPTIONS:
Load Rinse During Polish Interval
Steady
Conserve Load stations will be briefly rinsed at intervals.
Load stations will be steadily rinsed.
Load stations will not be rinsed.
Spindle Flushing
(Will not show is
Carrier X is used.)
Enbl/Dsbl Enables spindle flushing after wafer unloading.
Fountain Rinsing Enbl/Dsbl Enables fountain rinsing after wafers are unloaded from
spindles. Some machines have dedicated sprays for
fountain rinse.
For the HydroLift load station, this turns on the
HydroLift spray. Note: If this spray is not desired
during the post polish wafer rinsing sequence, this must
be set to zero if the "Fountain Rinse" time (Machine
Parameters menu, page 2) is set to zero.
Tbl Start W/Slurry (0-dsbl) Causes the table to rotate during slurry prestart at the
rpm entered. A "0" entry disables the choice.
The table will rotate in the same direction as the first
polish step for the table (Step 1 for the primary table
and Step 11 for the secondary table).
Ranges:
0 to 250 rpm (7.5:1 gearbox ratio)
0 to 190 rpm (10:1 gearbox ratio)
0 to 125 rpm (15:1 gearbox ratio)
0 to 100 rpm (20:1 gearbox ratio)
Rotate Prestart Enbl/Dsbl
Causes the table and spindles to start rotating before
they are lowered onto the table.
Curtain Rinse Disable
Enbl 10rpm
Enbl 20rpm
Enbl 30rpm
Enbl 40rpm
Enbl 50rpm Enables the optional curtain rinse and sets the curtain
rinsing spindle rotation speed. If the machine has the
front-to-back throughput option, this also enables using
the curtain rinse to keep the wafers wet after polishing if
the robot is still busy loading the next wafers.
Curtain Rinse Time Sets the time each carrier will be curtain rinsed.
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