3 General Safety Precautions and Usage Considerations
3-13
3.5.3 Soldering
temperature
profile
The soldering temperature and heating time vary from device to device. Therefore, when specifying the
mounting conditions, refer to the individual datasheets and databooks for the devices used.
(1) Using medium infrared ray reflow
•
Heating top and bottom with long or medium infrared rays is recommended (see Figure 3).
Long infrared ray heater (preheating)
Medium infrared ray heater
(reflow)
Product flow
Figure 3 Heating top and bottom with long or medium infrared rays
•
Complete the infrared ray reflow process for 30 to 50 seconds at a package surface temperature of between
230°C and 260°C.
•
Refer to Figure 4 for an example of a good temperature profile for infrared or hot air reflow.
230
30-50 s
Time (s)
60-120 s
(°C)
260
190
180
P
ack
age
surface tem
perature
Figure 4 Sample temperature profile (Pb free) for infrared or hot air reflow
(2) Using hot air reflow
•
Complete hot air reflow for 30 to 50 seconds at a package surface temperature of between 230°C and 260°C.
•
For an example of a recommended temperature profile, refer to Figure 4 above.
3.5.4
Flux cleaning and ultrasonic cleaning
(1) When cleaning circuit boards to remove flux, make sure that no residual reactive ions such as Na or Cl
remain. Note that organic solvents react with water to generate hydrogen chloride and other corrosive gases
which can degrade device performance.
(2) Washing devices with water will not cause any problems. However, make sure that no reactive ions such as
sodium and chlorine are left as a residue. Also, be sure to dry devices sufficiently after washing.
Summary of Contents for TX49 TMPR4937
Page 1: ...64 Bit TX System RISC TX49 Family TMPR4937 Rev 2 0 ...
Page 4: ......
Page 13: ...Table of Contents ix TMPR4937 Revision History 1 ...
Page 14: ...Table of Contents x ...
Page 15: ...Handling Precautions ...
Page 16: ......
Page 18: ...1 Using Toshiba Semiconductors Safely 1 2 ...
Page 40: ...3 General Safety Precautions and Usage Considerations 3 18 ...
Page 42: ...4 Precautions and Usage Considerations 4 2 ...
Page 43: ...TMPR4937 2005 3 Rev 2 0 ...
Page 44: ......
Page 52: ...Chapter 1 Overview and Features 1 6 ...
Page 156: ...Chapter 7 External Bus Controller 7 56 ...
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Page 506: ...Chapter 20 Extended EJTAG Interface 20 8 ...
Page 530: ...Chapter 22 Pinout and Package Information 22 10 ...
Page 542: ...Chapter 24 Parts Number when Ordering 24 2 ...